摘要:
A method of epitaxial growth of a 4H-SiC single crystal enabling growth of an SiC single crystal with low defects and low impurities able to be used for a semiconductor material at a practical growth rate, comprising growing a 4H-SiC single crystal on a 4H-SiC single crystal substrate by epitaxial growth while inclining an epitaxial growth plane of the substrate from a (0001) plane of the 4H-SiC single crystal by an off-angle of at least 12 degrees and less than 30 degrees in a axial direction, and a 4H-SiC single crystal obtained by the same.
摘要:
SiC single crystal (2a) that includes a first dopant functioning as an acceptor, and a second dopant functioning as a donor is provided, where the content of the first dopant is no less than 5 × 10 15 atoms/cm 3 , the content of the second dopant is no less than 5 × 10 15 atoms/cm 3 , and the content of the first dopant is greater than the content of the second dopant. A manufacturing method for silicon carbide single crystal (2a) is provided with the steps of: fabricating a raw material (2) by mixing a metal boride with a material that includes carbon and silicon; vaporizing the raw material (2); generating a mixed gas that includes carbon, silicon, boron and nitride; and growing silicon carbide single crystal (2a) that includes boron and nitrogen on a surface of a seed crystal substrate (1) by re-crystallizing the mixed gas on the surface of the seed crystal substrate (1).
摘要翻译:SiC单晶(2a)中做了包括第一掺杂剂,其作为到受体,和第二掺杂剂用作施主被提供,其中,所述第一掺杂剂的含量为不小于5×10 15原子/ cm 3时,内容 所述第二掺杂剂是不小于5×10 15原子/ cm 3以下,并且所述第一掺杂剂的含量大于所述第二掺杂剂的含量更高。 对于碳化硅单晶(2a)中的制造方法具有如下步骤:通过混合金属硼化物与材料的制造原料(2)并包括碳和硅; 蒸发原料(2); 产生的混合气体做包括碳,硅,硼和氮化物; 和生长碳化硅单晶(2a)中那样包括籽晶衬底(1)的表面上的硼和氮通过重结晶的混合气体在晶种基板的表面上(1)。
摘要:
A method of epitaxial growth of a 4H-SiC single crystal enabling growth of an SiC single crystal with low defects and low impurities able to be used for a semiconductor material at a practical growth rate, comprising growing a 4H-SiC single crystal on a 4H-SiC single crystal substrate by epitaxial growth while inclining an epitaxial growth plane of the substrate from a (0001) plane of the 4H-SiC single crystal by an off-angle of at least 12 degrees and less than 30 degrees in a axial direction, and a 4H-SiC single crystal obtained by the same.