公开(公告)号：EP3196339A4

公开(公告)日：2017-11-29

申请号：EP15842761

申请日：2015-09-14

申请人： UEMURA KOGYO KK

发明人： YAMAMOTO HISAMITSU ,  KAWASE TOMOHIRO ,  TAKEUCHI MASAHARU

IPC分类号： C23C18/40 ,  C23C18/16 ,  H05K3/10 ,  H05K3/18 ,  H05K3/40 ,  H05K3/42

CPC分类号： C23C18/52 ,  C23C2/003 ,  C23C2/02 ,  C23C2/04 ,  C23C18/1603 ,  C23C18/1633 ,  C23C18/1669 ,  C23C18/36 ,  C23C18/40 ,  C23C18/405 ,  H05K3/10 ,  H05K3/107 ,  H05K3/18 ,  H05K3/187 ,  H05K3/40 ,  H05K3/422

摘要： Disclosed herein is a method for fabricating a wiring board in which a target substrate having via holes and/or trenches is subjected to an electroless plating process while being immersed in an electroless plating solution to fill the via holes and/or the trenches with a plating metal. The method includes the steps of: supplying the electroless plating solution to under the target substrate; diffusing an oxygen-containing gas into the electroless plating solution supplied under the target substrate; and allowing the electroless plating solution to overflow from over the target substrate.

公开(公告)号：EP0164135A3

公开(公告)日：1986-12-30

申请号：EP85107086

申请日：1985-06-07

申请人： UEMURA KOGYO KK

发明人： SAITO, MASAHIRO ,  NAKABAYASHI, AKIRA

IPC分类号： G11B5/66 ,  G11B5/73 ,  G11B5/738 ,  G11B5/82 ,  G11B5/84 ,  G11B5/704

CPC分类号： G11B5/7305 ,  Y10S428/90 ,  Y10S428/928 ,  Y10T428/12903 ,  Y10T428/12944 ,  Y10T428/31678

公开(公告)号：EP3156522A4

公开(公告)日：2017-11-08

申请号：EP15807050

申请日：2015-06-04

申请人： UEMURA KOGYO KK

发明人： KANO TOSHIKAZU ,  IKUMOTO RAIHEI ,  TSUJIMOTO MASANOBU

IPC分类号： C25D3/32 ,  C25D7/00

CPC分类号： C25D3/32