-
公开(公告)号：EP3084092A1
公开(公告)日：2016-10-26
申请号：EP14824296.9
申请日：2014-12-16
发明人： LYONS, Christopher S. , BANGE, Donna W. , BEDOYA, Cedric , ENGEN, Paul T. , HOGERTON, Peter B. , PIEPER, Joseph M. , PRESZLER PRINCE, Amy , YU, Ta-Hua , NIE, Qihong , MCCLURE, Donald J.
CPC分类号： E04B1/80 , B32B37/16 , B32B38/0008 , B32B2607/00 , C23C14/081 , C23C14/10 , C23C14/205 , C23C14/34 , E04B1/803 , E04B1/942 , E04B2001/7679 , E04C2/296 , Y02A30/242 , Y02B80/12
摘要： There is provided a vacuum insulation panel envelope having a substrate, a low thermal conductivity organic layer and a low thermal conductivity inorganic stack. The low thermal conductivity inorganic stack will include low thermal conductivity non-metallic inorganic materials and/or low thermal conductivity metallic materials.
-
2.发明公开BARRIER FILMS, VACUUM INSULATION PANELS AND MOISTURE BARRIER BAGS EMPLOYING SAME 审中-公开屏障膜，真空隔热板和使用相同的水分阻隔袋
公开(公告)号：EP3310572A1
公开(公告)日：2018-04-25
申请号：EP16730668.7
申请日：2016-06-09
发明人： MERTON, Christopher A. , YU, Ta-Hua , LYONS, Christopher S. , CHIA, Kam Poi , BEAMER, Brent , BEDOYA, Cedric , ENGEN, Paul T. , PRESZLER PRINCE, Amy
IPC分类号： B32B15/08 , B32B15/085 , B32B15/09 , B32B15/20 , B32B27/08 , B32B27/14 , B32B27/28 , B32B27/30 , B32B27/32 , B32B27/36 , E04B1/80 , B32B38/00
CPC分类号： B05D1/60 , B05D3/144 , B32B15/08 , B32B15/085 , B32B15/09 , B32B15/20 , B32B27/08 , B32B27/14 , B32B27/28 , B32B27/281 , B32B27/285 , B32B27/286 , B32B27/30 , B32B27/302 , B32B27/304 , B32B27/306 , B32B27/308 , B32B27/32 , B32B27/327 , B32B27/36 , B32B27/365 , B32B2250/05 , B32B2250/20 , B32B2255/10 , B32B2255/20 , B32B2255/205 , B32B2255/24 , B32B2255/26 , B32B2255/28 , B32B2307/00 , B32B2307/20 , B32B2307/202 , B32B2307/21 , B32B2307/212 , B32B2307/304 , B32B2307/3065 , B32B2307/31 , B32B2307/412 , B32B2307/414 , B32B2307/7246 , B32B2607/00 , C23C14/081 , C23C14/205 , C23C14/34 , E04B1/803 , Y02A30/242 , Y02B80/12
摘要： There is provided a barrier film having a substrate, a low thermal conductivity organic layer and an inorganic stack. The inorganic stack will include a low thermal conductivity non-metallic inorganic material layer and a high thermal conductivity metallic material layer.
-
搜索结果
2 条记录 (耗时 0.009 秒)
