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1.发明公开ASSEMBLY BONDED TO A STRUCTURAL ADHESIVE AND METHOD AND APPLICATOR FOR MAKING IT 审中-公开根据上述制造合同事实均不建筑水泥和方法以及设备配置
公开(公告)号：EP2222808A2
公开(公告)日：2010-09-01
申请号：EP08860712.2
申请日：2008-11-26
CPC分类号： C09J5/02 , B32B7/10 , B32B7/12 , B32B13/12 , B32B15/092 , B32B15/095 , B32B15/098 , B32B21/08 , B32B27/08 , B32B27/20 , B32B27/283 , B32B27/308 , B32B2255/06 , B32B2255/10 , B32B2255/26 , B32B2307/4026 , B32B2307/422 , B32B2307/54 , B32B2307/542 , B32B2307/702 , B32B2307/752 , B32B2605/08 , C08L25/10 , C08L59/00 , C08L2666/14 , C09J163/00 , C09J2400/163 , C09J2400/166
摘要： The invention provides an assembly comprising at least one substrate being bonded to a structural adhesive wherein the structural adhesive is obtained by curing a precursor comprising a cross-linkable polymer, wherein a surface area of the substrate bonded to the structural adhesive comprises at least one metal, said surface area being treated with a liquid activator.
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公开(公告)号：EP2104721A1
公开(公告)日：2009-09-30
申请号：EP08713823.6
申请日：2008-01-18
IPC分类号： C09J163/00
CPC分类号： C09J163/00 , C08L2666/02 , Y10T428/31515
摘要： A heat-curable adhesive composition comprising an epoxy-resin, a toughening agent, a curing agent and an acetoacetoxy-functionalized compound wherein the composition can be cured to form structural adhesives of high impact strength.
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公开(公告)号：EP4157958A1
公开(公告)日：2023-04-05
申请号：EP21727944.7
申请日：2021-05-21
发明人： JUNG, Adrian T. , TASCH, Boris Ove Alexander , CURA, Elisabeth , KLÜNKER, Eike H. , BISSINGER, Peter , STEIGER, Wolf , HASENBERG, Dirk
IPC分类号： C09J133/00 , C08G59/40 , C08G59/68 , C09J163/00 , C09J133/10
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公开(公告)号：EP3916065A1
公开(公告)日：2021-12-01
申请号：EP20176290.3
申请日：2020-05-25
发明人： JUNG, Adrian , TASCH, Boris , CURA, Elisabeth , KLÜNKER, Eike , BISSINGER, Peter , STEIGER, Wolf , HASENBERG, Dirk
IPC分类号： C09J133/00 , C08G59/40 , C08G59/68 , C09J163/00
摘要： The present disclosure relates to a curable precursor of a structural adhesive composition, comprising:
a) a thermally curable resin;
b) a thermal curing initiator for the thermally curable resin;
c) a radiation self-polymerizable multi-functional compound comprising a polyether oligomeric backbone and at least one free-radical (co)polymerizable reactive group at each terminal position of the oligomer backbone; and
d) a free-radical polymerization initiator for the radiation self-polymerizable multi-functional compound.-
公开(公告)号：EP2104721B1
公开(公告)日：2011-11-02
申请号：EP08713823.6
申请日：2008-01-18
发明人： GOEB, Siegfried , HASENBERG, Dirk , KLONINGER, Christian , KOLOWROT, Dirk , TRASER, Steffen , GORODISHER, Ilya , POCIUS, Alphonsus V. , Dr.
IPC分类号： C09J163/00
CPC分类号： C09J163/00 , C08L2666/02 , Y10T428/31515
摘要： A heat-curable adhesive composition comprising an epoxy-resin, a toughening agent, a curing agent and an acetoacetoxy-functionalized compound wherein the composition can be cured to form structural adhesives of high impact strength.
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