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公开(公告)号:EP4361229A1
公开(公告)日:2024-05-01
申请号:EP22204721.9
申请日:2022-10-31
发明人: CURA, Elisabeth , TASCH, Boris , KLÜNKER, Eike , STEIGER, Wolf , BISSINGER, Peter , JUNG, Adrien
CPC分类号: C09J5/06 , C09J7/10 , C09J2203/35420200801 , C09J2203/32620130101 , C09J2203/3520200801 , C09J2301/20820200801 , C09J2301/30420200801 , C09J2301/40820200801 , C09J2301/41620200801 , C09J2463/0020130101 , C09J2433/0020130101 , C09J2301/124220200801 , C08K5/0025
摘要: According to one aspect, the present disclosure relates to a multilayer structural adhesive tape, comprising
(iii) at least one first adhesive layer (A), comprising (a) a thermally curable adhesive composition, (b) a thermal curing initiator for the thermally curable resin, (c) a polymeric material comprising the self-polymerization reaction product of a polymerizable material comprising a radiation self-polymerizable multi-functional compound, (d) optionally, some residual free-radical polymerization initiator for the radiation self-polymerizable multi-functional compound;
(iv) at least one second adhesive layer (B), comprising (a) a thermally curable adhesive composition, (b) a thermal curing initiator for the thermally curable resin, (c) a polymeric material comprising the self-polymerization reaction product of a polymerizable material comprising a radiation self-polymerizable multi-functional compound, (d) optionally, some residual free-radical polymerization initiator for the radiation self-polymerizable multi-functional compound;
wherein
the thermally curable resins in the at least one first adhesive layer (A) and in the at least one second adhesive layer (B) are uncured and are in particular embedded into the polymeric material comprising the self-polymerization reaction product of a polymerizable material comprising a radiation self-polymerizable multi-functional compound;
wherein the self-polymerization of the polymerizable material comprising a radiation self-polymerizable multi-functional compound was effectuated by irradiation of a free-radical polymerization initiator for the radiation self-polymerizable multi-functional compound with light;
wherein the at least first adhesive layer (A) is different from the at least one second adhesive layer (B).-
公开(公告)号:EP3916065A1
公开(公告)日:2021-12-01
申请号:EP20176290.3
申请日:2020-05-25
发明人: JUNG, Adrian , TASCH, Boris , CURA, Elisabeth , KLÜNKER, Eike , BISSINGER, Peter , STEIGER, Wolf , HASENBERG, Dirk
IPC分类号: C09J133/00 , C08G59/40 , C08G59/68 , C09J163/00
摘要: The present disclosure relates to a curable precursor of a structural adhesive composition, comprising:
a) a thermally curable resin;
b) a thermal curing initiator for the thermally curable resin;
c) a radiation self-polymerizable multi-functional compound comprising a polyether oligomeric backbone and at least one free-radical (co)polymerizable reactive group at each terminal position of the oligomer backbone; and
d) a free-radical polymerization initiator for the radiation self-polymerizable multi-functional compound.
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