公开(公告)号：EP3569669A1

公开(公告)日：2019-11-20

申请号：EP18172158.0

申请日：2018-05-14

申请人： 3M Innovative Properties Company

发明人： Torre, Claudia ,  Underhau, Kerstin ,  Kuester, Frank ,  Wieneke, Jan ,  Stricker, Andrea

IPC分类号： C09J7/38 ,  B32B27/00 ,  C09J5/08

摘要： The present disclosure to a method of manufacturing an electronic control device comprising a housing body comprising a first part and a second part, wherein the method comprises the steps of:
1) providing a housing body comprising a first part and a second part;
2) providing a multilayer pressure sensitive adhesive assembly comprising a first pressure sensitive adhesive polymeric layer having a first pressure sensitive adhesive composition adjacent to a second pressure sensitive adhesive polymeric foam layer having a second pressure sensitive adhesive composition; wherein the second pressure sensitive adhesive composition comprises:
a) a polymer base material selected from the group consisting of polyacrylates, polyurethanes, polyolefins, polyamines, polyamides, polyesters, polyethers, polyisobutylene, polystyrenes, polyvinyls, polyvinylpyrrolidone, natural rubbers, synthetic rubbers, and any combinations, copolymers or mixtures thereof; and
b) optionally, a hollow non-porous particulate filler material;

3) adhering the first pressure sensitive adhesive polymeric layer to the first part; and
4) adhering the second part to the second pressure sensitive adhesive polymeric foam layer.
According to another aspect, the present disclosure is directed to a composite assembly comprising:
a) an electronic control device comprising a housing body comprising a first part and a second part as described in any of claims 1 to 12; and
b) a multilayer pressure sensitive adhesive assembly as described above, wherein the first pressure sensitive adhesive polymeric layer is adhered to the first part of the housing body, and the second pressure sensitive adhesive polymeric foam layer is adhered to the second part of the housing body.
According to still another aspect, the present disclosure relates to the use of a multilayer pressure sensitive adhesive assembly as described above for manufacturing an electronic control device.

公开(公告)号：EP4328254A1

公开(公告)日：2024-02-28

申请号：EP22191573.9

申请日：2022-08-22

申请人： 3M Innovative Properties Company

发明人： Heering, Christian ,  Schmidt, Tomasz ,  Vadillo, Damien Christian ,  Backes, Andreas ,  Schneider, Peter Jan ,  Jung, Adrian Thomas ,  Tasch, Boris ,  Stricker, Andrea ,  Kröger, Anna Pia Pauline

IPC分类号： C08G59/00 ,  C08L63/00

摘要： The present disclosure provides a printable structural adhesive composition. The present disclosure further provides methods for applying a structural adhesive onto a substrate, the method comprising printing the structural adhesive onto the substrate. Printing may be carried out by jet printing, pad printing, screen printing and/or stencil printing.