中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

213 records (took 0.024 seconds)

    A WATER-BASED ADHESIVE COMPOSITION AND A PROCESS TO FOAM IT
    5.
    发明授权
    A WATER-BASED ADHESIVE COMPOSITION AND A PROCESS TO FOAM IT 有权
    水基粘合剂组合物及其发泡工艺

    公开(公告)号：EP2438126B1

    公开(公告)日：2018-02-21

    申请号：EP09779627.0

    申请日：2009-06-03

    Applicant: Henkel AG & Co. KGaA

    Inventor： CAVALLI, Dario

    IPC: C09J5/08 ,  C08J9/08

    CPC classification number: C09J5/08 ,  C08J9/08 ,  C08J2201/022 ,  C08J2207/02 ,  C09J2403/00 ,  C09J2429/00 ,  C09J2431/00

    Abstract: A process to apply a foamable water-based adhesive comprises combining, in a pressure-tight container having an outlet valve, a) a first aqueous polymer having a pH-value above 6 and containing a dissolved or dispersed salt that can liberate a gas, and b) a second aqueous polymer comprising an acid and having a pH-value lower than 5, and combined aqueous releasing the combined aqueous polymers from the pressure-tight container through the outlet valve onto a substrate, whereby gas bubbles are formed in the aqueous polymers leaving the valve, thus foaming the water-based adhesive.

    APPLICATION OF ADHESIVES
    6.
    发明公开
    APPLICATION OF ADHESIVES 审中-公开
    粘合剂的应用

    公开(公告)号：EP3221410A1

    公开(公告)日：2017-09-27

    申请号：EP15797355.3

    申请日：2015-11-20

    Applicant: Zephyros Inc.

    Inventor： MEISTERMANN, Laurent ,  ELKAIM, Eric

    IPC: C09J5/06 ,  C09J5/08 ,  C09J5/10

    CPC classification number: C09J5/06 ,  C08J2203/04 ,  C08L2205/03 ,  C09J5/08 ,  C09J5/10

    Abstract: Applying heat activatable adhesive to a substrate, the adhesive is solid at ambient temperature and can be melted at a temperature below its heat activation temperature wherein the adhesive formulation is supplied to a hot melt applicator where it is heated to above its melting point and below its activation temperature and the melt viscosity of the molten adhesive is controlled so that it can be ejected from the hot melt applicator onto a substrate to provide a coherent bead that adheres to the substrate and is dry to the touch on cooling and upon activation the adhesive is capable of expanding with a volume expansion greater than about 250 %.

    Abstract translation: 将可热活化的粘合剂施加到基材上，该粘合剂在环境温度下为固体，并且可以在低于其热活化温度的温度下熔化，其中将粘合剂配制剂供应至热熔涂覆器，在所述热熔涂覆器中将粘合剂配制剂加热至高于其熔点并低于其熔点 控制熔融粘合剂的活化温度和熔融粘度，以使其可从热熔涂敷器喷射到基材上以提供粘附到基材上并在冷却时触摸干燥并且在活化时粘合剂 能够以大于约250％的体积膨胀进行膨胀。

    THERMALLY POST-CURABLE PRESSURE SENSITIVE ADHESIVE
    7.
    发明公开
    THERMALLY POST-CURABLE PRESSURE SENSITIVE ADHESIVE 审中-公开
    热后固化压敏胶粘剂

    公开(公告)号：EP3159386A1

    公开(公告)日：2017-04-26

    申请号：EP15191301.9

    申请日：2015-10-23

    Applicant: 3M Innovative Properties Company

    Inventor： Unverhau, Kerstin ,  Richter, Mareike ,  Mechernich, Silke ,  Klink, Anne-Marie

    IPC: C09J5/06 ,  C09J5/08

    CPC classification number: C09J5/06 ,  C08J2203/22 ,  C09J5/08 ,  C09J2433/00

    Abstract: The present disclosure relates to a method of applying a pressure sensitive adhesive to a substrate, which comprises the steps of:
    a) providing an uncrosslinked curable precursor of a pressure sensitive adhesive comprising:
    (1) a (meth)acrylate copolymer component comprising:
    i. C 1 -C 32 (meth)acrylic acid ester monomer units;
    ii. ethylenically unsaturated monomer units having functional groups selected from the group consisting of acid, hydroxyl, acid anhydride, epoxide, amine, amide groups, and any combinations thereof; and
    iii. optionally, further ethylenically unsaturated monomer units which are copolymerizable with monomer units (i) and/or (ii);

    (2) a thermal crosslinking system;
    (3) at least one expandable microsphere;
    (4) optionally, a tackifying system; and
    (5) optionally, at least one pigment;

    b) subjecting the curable precursor of a pressure sensitive adhesive to a first heating step such that the curable precursor of a pressure sensitive adhesive is partially crosslinked;
    c) contacting the curable precursor of a pressure sensitive adhesive obtained in step b) to at least part of the surface of the substrate;
    d) subjecting the curable precursor of a pressure sensitive adhesive to a second heating step such that the curable precursor of a pressure sensitive adhesive is fully crosslinked; and
    e) optionally, allowing the polymeric foam layer to cool down on the substrate.

    Abstract translation: 包括以下步骤：a）提供压敏粘合剂的未交联的可固化前体，所述压敏粘合剂包含：（1）（甲基）丙烯酸酯共聚物组分，其包含： 。 C1-C32（甲基）丙烯酸酯单体单元; II。 具有选自酸，羟基，酸酐，环氧化物，胺，酰胺基及其任何组合的官能团的烯属不饱和单体单元; 和iii。 任选地，可与单体单元（i）和/或（ii）共聚的其他烯键式不饱和单体单元; （2）热交联体系; （3）至少一个可膨胀微球体; （4）任选地，增粘系统; 和（5）任选地，至少一种颜料; b）将压敏粘合剂的可固化前体进行第一加热步骤，使得压敏粘合剂的可固化前体部分交联; c）将在步骤b）中获得的压敏粘合剂的可固化前体与基材的至少部分表面接触; d）将压敏粘合剂的可固化前体进行第二加热步骤，使得压敏粘合剂的可固化前体完全交联; 和e）任选地，允许聚合物泡沫层在基材上冷却。

    POWDERED ADHESIVES
    9.
    发明公开
    POWDERED ADHESIVES 审中-公开
    PULVERFÖRMIGEKLEBSTOFFE

    公开(公告)号：EP3122831A1

    公开(公告)日：2017-02-01

    申请号：EP15720448.8

    申请日：2015-03-30

    Applicant: Zephyros Inc.

    Inventor： CHENE, Morgan ,  HENRY, Christophe

    IPC: C09J5/06 ,  C09J5/08 ,  C09J9/00 ,  C09J163/00

    CPC classification number: C09J5/06 ,  B05D1/06 ,  C08G2650/56 ,  C08L51/04 ,  C08L63/00 ,  C09J5/08 ,  C09J9/00 ,  C09J163/00 ,  C09J2463/00

    Abstract: An adhesive comprising a solvent free powder of average particle size in the range 20 to 300 preferably 20 to 150 microns is heat activated at a temperature in the range 140° C. to 220° C., is flowable at a temperature below the heat activation temperature and is dry and non-tacky to the touch at ambient temperature, the use of a powdered adhesive is particularly useful for bonding of non-planar surfaces with complex contours.

    Abstract translation: 包含平均粒度在20至300范围内，优选20至150微米范围内的无溶剂粉末的粘合剂在140℃至220℃的温度下热活化，可在低于热活化的温度下流动 温度，并且在环境温度下是干燥的和不粘的触摸，使用粉末粘合剂对于具有复杂轮廓的非平面表面的结合特别有用。

Patent Agency Ranking