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    POLYMER CONCRETE ELECTRICAL INSULATION SYSTEM
    7.
    发明授权
    POLYMER CONCRETE ELECTRICAL INSULATION SYSTEM 有权
    电聚合物混凝土隔离系统

    公开(公告)号：EP2198433B1

    公开(公告)日：2011-03-02

    申请号：EP07821006.9

    申请日：2007-10-08

    申请人： ABB Research Ltd.

    发明人： CLIFFORD, Stephen ,  SOYEUX, Faustine ,  KRIVDA, Andrej ,  TILLIETTE, Vincent ,  ZANT, Nikolaus ,  SINGH, Bandeep ,  GREUTER, Felix ,  RITZER, Leopold

    IPC分类号： H01B3/40 ,  C08L63/00 ,  C08K3/36

    CPC分类号： H01B3/40 ,  C08K3/36 ,  Y10T428/25 ,  Y10T428/252 ,  Y10T428/256 ,  Y10T428/257 ,  Y10T428/259 ,  Y10T428/269 ,  C08L63/00

    摘要： Polymer concrete electrical insulation system comprising a hardened epoxy resin composition filled with an electrically non-conductive inorganic filler composition, wherein said polymer concrete electrical insulation system optionally may contain further additives, and wherein (a) the epoxy resin composition is based on a cycloaliphatic epoxy resin; (b) the inorganic filler composition is present within the range of about 76 % by weight to about 86 % by weight, calculated to the total weight of the polymer concrete electrical insulation system; (c) the inorganic filler composition comprises a uniform mixture of (i) an inorganic filler with an average grain size within the range of 1 micron (µm) to 100 micron (µm) [component c(i)], and (ii) an inorganic filler with an average grain size within the range of 0.1 mm (100 micron) to 2 mm [component c(ii)]; wherein (d) the inorganic filler with an average grain size within the range of 1 micron (µm) to 100 micron (µm) [component c(i)] is present in an amount within the range of 22 % to 42 %, calculated to the total weight of the polymer concrete electrical insulation system; and (e) the inorganic filler with an average grain size within the range of 0.1 mm to 2 mm [component c(ii)] is present within the range of 41 % to 61 % by weight, calculated to the total weight of the polymer concrete electrical insulation system; and method of producing said electrical insulation system.

    LASER TREATED ELECTRICALLY CONDUCTIVE SUBSTRATE AND PRE-TREATING METHOD THEREOF
    8.
    发明公开
    LASER TREATED ELECTRICALLY CONDUCTIVE SUBSTRATE AND PRE-TREATING METHOD THEREOF 有权
    LASERBEHANDELTES ELEKTRISCH LEITENDES SUBSTRAT UND VORBEHANDLUNGSVERFAHRENDAFÜR

    公开(公告)号：EP2719041A1

    公开(公告)日：2014-04-16

    申请号：EP11727944.8

    申请日：2011-06-08

    申请人： ABB Research Ltd.

    发明人： ZANT, Nikolaus ,  GUSTAFSSON, Emilia ,  VELTHUIS, Rudi ,  GASPARINI, Rico ,  GREUTER, Felix

    IPC分类号： H02G5/06 ,  B23K26/00

    CPC分类号： B29C39/10 ,  B23K26/0078 ,  B29C37/0082 ,  B29C47/0009 ,  B29C47/02 ,  B29C65/48 ,  B29C66/30322 ,  B29C66/71 ,  B29C66/742 ,  H02G5/066 ,  B29K2063/00

    摘要： A method of pre-treating an electrically conductive substrate (12) for bonding a non-metallic material (14) thereon is provided. The method includes: (a) placing the substrate (12) in a laser range of a laser source (16); and (b) irradiating a surface (18) of the substrate (12) with a laser light (24) from the laser source (16), thereby forming a micro-structure (20) on the substrate surface (18). The micro-structure (20) has at least one of: a) an I/Ra ratio of at least 0.2 μm
    -1 , I being the surface index, Ra being the average roughness; or b) an I/Rz ratio of at least 0.03 μm
    -1 , I being the surface index, Rz being the average peak-to-valley distance. An electrically conductive substrate (12), a metal insert (12, 603) for use with a solid insulation component (704, 706, 712, 714), an insulator-conductor assembly (26), and a gas-insulated switchgear station (700) are also provided as well as use of an insulator-conductor assembly (26, 600) in an electrical power system (700).

    摘要翻译： 提供了一种预处理用于在其上粘合非金属材料（14）的导电基板（12）的方法。 该方法包括：（a）将基板（12）放置在激光源（16）的激光范围内; 和（b）用来自激光源（16）的激光（24）照射衬底（12）的表面（18），从而在衬底表面（18）上形成微结构（20）。 微结构（20）具有以下至少一种：a）I / Ra比为至少0.2μm-1，I为表面指数，Ra为平均粗糙度; 或b）至少为0.03μm-1的I / Rz比，I为表面指数，Rz为平均峰谷距离。 导电基板（12），与固体绝缘部件（704,706,712,714）一起使用的金属插入件（12,603），绝缘体 - 导体组件（26）和气体绝缘开关设备站 700）以及在电力系统（700）中使用绝缘体 - 导体组件（26,600）。