公开(公告)号：EP3174093A1

公开(公告)日：2017-05-31

申请号：EP16199913.1

申请日：2016-11-22

Applicant: ABB Technology Oy

Inventor： Silvennoinen, Mika ,  Manninen, Jorma ,  Pakarinen, Joni

IPC: H01L23/427

Abstract: A power electronic assembly comprising a power electronic module incorporating multiple of semiconductor power electronic switch components, the power electronic module comprising a base plate, a vapour chamber having one or more condenser pipes in fluid communication with the vapour chamber, the vapour chamber and the one or more condenser pipes forming a closed volume and enclosing a working fluid, a mounting plate having an indent for receiving the vapour chamber and one or more apertures for receiving the one or more condenser pipes, wherein the power electronic module is attached to the mounting plate to transfer heat from the base plate of the power electronic module to the vapour chamber.

Abstract translation: 一种电力电子组件，包括结合有多个半导体功率电子开关部件的电力电子模块，所述电力电子模块包括基板，具有一个或多个冷凝管的蒸气室，所述冷凝管与所述蒸汽室流体连通，所述蒸气室和所述一个 或更多的冷凝器管道，其形成封闭容积并封闭工作流体;安装板，其具有用于接收蒸汽室的凹口;以及一个或多个孔口，用于接收所述一个或多个冷凝器管道，其中功率电子模块附接到安装板 以将热量从功率电子模块的基板传递到蒸气室。