公开(公告)号：EP3361847A1

公开(公告)日：2018-08-15

申请号：EP17155992.5

申请日：2017-02-14

Applicant: ABB Technology Oy

Inventor： Manninen, Jorma ,  Kärppä, Jaani ,  Kinnunen, Tuomo

IPC: H05K7/20

CPC classification number: H05K7/20936 ,  F28D15/0275 ,  H01L23/427 ,  H05K7/20336

Abstract: The invention relates to a heat exchanger (1) comprising a heat input section (2) and a heat output section (3a-b). The heat input section (2) and the heat output section (3a-b) containing a working fluid (5) in a plurality of channels (4). The plurality of channels (4) providing a flow path for the working fluid (5) to move between the heat input section (2) and the heat output section (3a-b). The plurality of channels (4) being capillary dimensioned for the working fluid (5). The heat output section (3a-b) comprises a cooling liquid chamber (6) and an inlet (7) and an outlet (8) for cooling liquid (10). The heat exchanger (1) comprises two heat output sections (3a-b) arranged on the first end (9a) and the second end (9b) of the heat input section (2). The plurality of channels (4) extend from the first heat output section (3a) through the heat input section (2) to the second heat output section (3b).

公开(公告)号：EP3174093A1

公开(公告)日：2017-05-31

申请号：EP16199913.1

申请日：2016-11-22

Applicant: ABB Technology Oy

Inventor： Silvennoinen, Mika ,  Manninen, Jorma ,  Pakarinen, Joni

IPC: H01L23/427

Abstract: A power electronic assembly comprising a power electronic module incorporating multiple of semiconductor power electronic switch components, the power electronic module comprising a base plate, a vapour chamber having one or more condenser pipes in fluid communication with the vapour chamber, the vapour chamber and the one or more condenser pipes forming a closed volume and enclosing a working fluid, a mounting plate having an indent for receiving the vapour chamber and one or more apertures for receiving the one or more condenser pipes, wherein the power electronic module is attached to the mounting plate to transfer heat from the base plate of the power electronic module to the vapour chamber.

Abstract translation: 一种电力电子组件，包括结合有多个半导体功率电子开关部件的电力电子模块，所述电力电子模块包括基板，具有一个或多个冷凝管的蒸气室，所述冷凝管与所述蒸汽室流体连通，所述蒸气室和所述一个 或更多的冷凝器管道，其形成封闭容积并封闭工作流体;安装板，其具有用于接收蒸汽室的凹口;以及一个或多个孔口，用于接收所述一个或多个冷凝器管道，其中功率电子模块附接到安装板 以将热量从功率电子模块的基板传递到蒸气室。

公开(公告)号：EP3096351B1

公开(公告)日：2017-12-13

申请号：EP15168863.7

申请日：2015-05-22

Applicant: ABB Technology Oy

Inventor： Manninen, Jorma ,  Silvennoinen, Mika ,  Mörsky, Heikki

IPC: H01L23/373 ,  H01L23/42

CPC classification number: H05K7/209 ,  C08K3/22 ,  C08K2003/2227 ,  C08K2003/2272 ,  C09D183/04 ,  H01L23/3735 ,  H01L23/3736 ,  H01L23/3737 ,  H01L23/42

Abstract: A method of producing a power electronic assembly and a power electronic assembly comprising a power electronic module incorporating multiple of semiconductor power electronic switch components, the power electronic module comprising a bottom surface, the power electronic assembly comprises further a cooling arrangement for cooling the power electronic module, the cooling arrangement comprising a cooling surface adapted to be attached against the bottom surface of the power electronic module, wherein the power electronic assembly comprises further a thermal interface material arranged between the bottom surface of the power electronic module and the cooling surface of the cooling arrangement to transfer heat from the power electronic module to the cooling arrangement, the thermal interface material comprises an aluminium foil having a polymer coating.

公开(公告)号：EP3113590A1

公开(公告)日：2017-01-04

申请号：EP15174490.1

申请日：2015-06-30

Applicant: ABB Technology Oy

Inventor： Manninen, Jorma ,  Koivuluoma, Timo

IPC: H05K7/20 ,  H01L23/427 ,  F28D15/02

Abstract: The invention relates to a cooling apparatus (1) comprising a base plate (2) for receiving a heat load from an electric component (4), an evaporator (5), a condenser (9), and a connecting piece (8) for passing fluid (7) from the evaporator (5) to the condenser (9). In order to efficiently fill the evaporator, the cooling apparatus is provided with a pump (12) for pumping fluid (7) from the condenser (9) to the evaporator (5).

Abstract translation: 本发明涉及一种冷却装置（1），其包括用于接收来自电气部件（4），蒸发器（5），冷凝器（9）和连接件（8）的热负载的基板（2） 将来自蒸发器（5）的流体（7）传送至冷凝器（9）。 为了有效地填充蒸发器，冷却装置设置有用于将流体（7）从冷凝器（9）泵送到蒸发器（5）的泵（12）。

公开(公告)号：EP3086365A1

公开(公告)日：2016-10-26

申请号：EP15164821.9

申请日：2015-04-23

Applicant: ABB Technology Oy

Inventor： Manninen, Jorma ,  Silvennoinen, Mika ,  Myllykoski, Pirkka

IPC: H01L23/373

CPC classification number: H05K7/20936 ,  H01L23/367 ,  H01L23/373 ,  H01L23/42 ,  H01L23/46 ,  H01L23/473

Abstract: A power electronic assembly comprising a power electronic module incorporating multiple of semiconductor power electronic switch components, the power electronic module comprising a base plate, the power electronic assembly comprises further a cooling arrangement for cooling the power electronic module, the cooling arrangement comprising a cooling surface adapted to be attached against the base plate of the power electronic module. The power electronic assembly comprises further a carbon based material layer, which is arranged between the base plate of the power electronic module and the cooling surface of the cooling arrangement the carbon based material layer being adapted to compensate flatness deviations of the base plate of the power electronic module and to transfer heat from the power electronic module to the cooling arrangement.

Abstract translation: 一种电力电子组件，包括具有多个半导体功率电子开关组件的功率电子模块，所述功率电子模块包括基板，所述功率电子组件还包括用于冷却所述功率电子模块的冷却装置，所述冷却装置包括冷却表面 适于安装在电力电子模块的基板上。 电力电子组件还包括碳基材料层，其布置在电力电子模块的基板和冷却装置的冷却表面之间，碳基材料层适于补偿电源的基板的平坦度偏差 电子模块，并将热量从电力电子模块传递到冷却装置。

公开(公告)号：EP3096351A1

公开(公告)日：2016-11-23

申请号：EP15168863.7

申请日：2015-05-22

Applicant: ABB Technology Oy

Inventor： Manninen, Jorma ,  Silvennoinen, Mika ,  Mörsky, Heikki

IPC: H01L23/373 ,  H01L23/42

CPC classification number: H05K7/209 ,  C08K3/22 ,  C08K2003/2227 ,  C08K2003/2272 ,  C09D183/04 ,  H01L23/3735 ,  H01L23/3736 ,  H01L23/3737 ,  H01L23/42

Abstract: A method of producing a power electronic assembly and a power electronic assembly comprising a power electronic module incorporating multiple of semiconductor power electronic switch components, the power electronic module comprising a bottom surface, the power electronic assembly comprises further a cooling arrangement for cooling the power electronic module, the cooling arrangement comprising a cooling surface adapted to be attached against the bottom surface of the power electronic module, wherein the power electronic assembly comprises further a thermal interface material arranged between the bottom surface of the power electronic module and the cooling surface of the cooling arrangement to transfer heat from the power electronic module to the cooling arrangement, the thermal interface material comprises an aluminium foil having a polymer coating.

Abstract translation: 一种制造电力电子组件和电力电子组件的方法，包括具有多个半导体功率电子开关部件的功率电子模块，所述功率电子模块包括底表面，所述功率电子组件还包括用于冷却所述功率电子 模块，所述冷却装置包括适于抵靠所述电力电子模块的底表面附接的冷却表面，其中所述电力电子组件还包括布置在所述电力电子模块的底表面和所述电力电子模块的冷却表面之间的热界面材料 冷却装置将热量从功率电子模块传递到冷却装置，热界面材料包括具有聚合物涂层的铝箔。

公开(公告)号：EP3086366A1

公开(公告)日：2016-10-26

申请号：EP15173530.5

申请日：2015-06-24

Applicant: ABB Technology Oy

Inventor： Silvennoinen, Mika ,  Manninen, Jorma ,  Martinmaa, Juha

IPC: H01L23/427 ,  H01L23/373

CPC classification number: H05K7/20936 ,  H01L23/367 ,  H01L23/373 ,  H01L23/42 ,  H01L23/46 ,  H01L23/473

Abstract: A power electronic assembly and a method of producing a power electronic assembly. The assembly comprising a power electronic module having multiple of semiconductor power electronic switch components, the power electronic module comprising a base plate, the power electronic assembly comprising further a cooling arrangement for cooling the power electronic module. The cooling arrangement comprises a cooling surface adapted to be attached against the base plate of the power electronic module, wherein the cooling arrangement comprises further one or more heat pipes formed in the cooling surface for spreading the heat in the cooling arrangement and removing the heat from the cooling arrangement. The power electronic assembly comprises further a carbon based material layer arranged between the base pate of the power electronic module and the cooling surface of the cooling arrangement, the carbon based material layer being adapted to spread the heat generated by the semiconductor power electronic switch components and to transfer the heat from the power electronic assembly to the cooling arrangement.

Abstract translation: 电力电子组件和电力电子组件的制造方法。 所述组件包括具有多个半导体功率电子开关部件的功率电子模块，所述功率电子模块包括基板，所述功率电子组件还包括用于冷却所述功率电子模块的冷却装置。 冷却装置包括适于附接在功率电子模块的基板上的冷却表面，其中冷却装置还包括形成在冷却表面中的一个或多个热管，用于将热量散布在冷却装置中，并将热量从 冷却装置。 功率电子组件还包括布置在功率电子模块的基座和冷却装置的冷却表面之间的碳基材料层，碳基材料层适于扩展由半导体功率电子开关组件产生的热量， 以将热量从功率电子组件传递到冷却装置。

公开(公告)号：EP3012568A1

公开(公告)日：2016-04-27

申请号：EP14189488.1

申请日：2014-10-20

Applicant: ABB Technology Oy

Inventor： Manninen, Jorma ,  Koivuluoma, Timo

IPC: F28D15/00 ,  F28D15/02 ,  F28F17/00 ,  H05K7/20 ,  F28D1/04

CPC classification number: F25B21/02 ,  F24F2012/005 ,  F24F2013/225 ,  F24F2013/227 ,  F28D1/0426 ,  F28D15/00 ,  F28D15/0266 ,  F28D15/0275 ,  F28D2021/0028 ,  F28D2021/0038 ,  F28F17/005 ,  H05K7/202 ,  Y02B30/563

Abstract: A cooling device comprising a first chamber (1), a second chamber (2) separated from the first chamber (1), heat exchanger means (4) adapted to transfer heat from the first chamber (1) to the second chamber (2), and fan means. The first chamber (1) comprises an inlet flow opening (12) and an outlet flow opening (14). The fan means is adapted to generate a first cooling medium flow (511) inside the first chamber (1) between the inlet flow opening (12) and the outlet flow opening (14) such that heat is transferred from the first cooling medium flow (511) into the heat exchanger means.

Abstract translation: 一种冷却装置，包括第一室（1），与第一室（1）分离的第二室（2），适于将热量从第一室（1）传递到第二室（2）的热交换器装置（4） ，和风扇的意思。 第一腔室（1）包括入口流动开口（12）和出口流动开口（14）。 风扇装置适于在入口流动开口（12）和出口流动开口（14）之间的第一室（1）内部产生第一冷却介质流（511），使得热量从第一冷却介质流（ 511）进入热交换器装置。

公开(公告)号：EP2728289B1

公开(公告)日：2017-12-06

申请号：EP12190734.9

申请日：2012-10-31

Applicant: ABB Technology Oy

Inventor： Manninen, Jorma ,  Koivuluoma, Timo

IPC: F26B25/08 ,  H05K5/02

CPC classification number: F26B25/08 ,  F26B21/086 ,  H05K5/0213

Abstract: The equipment space (10) is a closed space provided with electrical equipment (40, 50) and an air dryer (30) condensing the moisture of the air in the equipment space (10) into water. The arrangement for removing water from the equipment space comprises a porous element (60) having a capillary structure and being situated in an outlet opening (70) of said equipment space (10). Water condensed by the air dryer (30) is directed to a first inner surface of the porous element (60), said water propagating in the capillary structure of the porous element (60) from the first inner surface of the porous element (60) to a second outer surface of the porous element (60) from which second outer surface of the porous element (60) the water is released to the ambient air outside the equipment space (10).