公开(公告)号：EP2793246A1

公开(公告)日：2014-10-22

申请号：EP14165486.3

申请日：2014-04-22

Applicant: ABL IP Holding LLC

Inventor： Wilson, John David

IPC: H01H50/14 ,  H01H71/02 ,  H01H71/08

CPC classification number: H01H45/04 ,  H01H50/14 ,  H01H71/0271 ,  H01H71/082 ,  H01H2071/0278 ,  Y10T29/49105

Abstract: A modular relay sub-assembly is provided. The modular relay sub-assembly can include a first housing portion, a second housing portion, a conductor having a first contact, and a split conductor. The second housing portion may be attached to a surface of the first housing portion. The conductor may be disposed inside a cavity formed by the two housing portions. The first contact may be accessible through a first opening in the first housing portion. The split conductor may include a first portion, a second portion, and a contact. The split conductor being disposed inside the cavity formed by the first and second housing portions. The second portion may be disposed at a position electrically isolated from the first portion. The contact of the split conductor can be accessible through a second opening in the first housing portion. The split conductor can be positioned to selectively contact the conductor.

Abstract translation: 提供了模块化继电器子组件。 模块化继电器子组件可以包括第一壳体部分，第二壳体部分，具有第一接触部的导体和分离导体。 第二壳体部分可以附接到第一壳体部分的表面。 导体可以设置在由两个壳体部分形成的空腔的内部。 第一接触件可以通过第一壳体部分中的第一开口接近。 分离导体可以包括第一部分，第二部分和接触部。 分离导体设置在由第一和第二壳体部分形成的空腔的内部。 第二部分可以设置在与第一部分电隔离的位置处。 分离导体的接触可以通过第一壳体部分中的第二开口接近。 分离导体可以定位成选择性地接触导体。

公开(公告)号：EP2793246B1

公开(公告)日：2016-11-30

申请号：EP14165486.3

申请日：2014-04-22

Applicant: ABL IP Holding LLC

Inventor： Wilson, John David

IPC: H01H50/14 ,  H01H45/04 ,  H01H71/02 ,  H01H71/08

CPC classification number: H01H45/04 ,  H01H50/14 ,  H01H71/0271 ,  H01H71/082 ,  H01H2071/0278 ,  Y10T29/49105