公开(公告)号：EP0744796A1

公开(公告)日：1996-11-27

申请号：EP96107228.7

申请日：1996-05-08

申请人： ALCATEL ITALIA S.p.A. ,  ALCATEL N.V.

发明人： Colombani, Luigi Angelo

IPC分类号： H01S3/025 ,  H01L21/304 ,  B28D5/00

CPC分类号： H01L21/3043 ,  B28D5/0023 ,  H01S5/0201 ,  H01S5/0202 ,  Y10T225/10 ,  Y10T225/12 ,  Y10T225/325 ,  Y10T225/371

摘要： A method and a device are provided for obtaining semiconductor bars for laser devices starting from portions of a processed wafer and carrying out the cleavage in ultra-high-vacuum. The cleavage mechanical stresses are impulsive forces and are all applied from the processed side of the wafer through a lowerable shaped member actuated by compressed helical springs, which applies these stresses on the ledging parts of the wafer portion hold on the central region thereof by a fixed support and hold down in position by a suitably shaped centering thrust member. The spring-up occurs by translating the device in the ultra-high-vacuum environment and contrasting a locking lever engaging the lowerable member in its upper position with a fixed cam.

摘要翻译： 提供一种方法和装置，用于从处理的晶片的部分开始获得用于激光装置的半导体条，并在超高真空中进行切割。 裂解机械应力是冲击力，并且都是从晶片的经处理侧通过由压缩螺旋弹簧致动的可下降的成形构件施加的，所述可降低的形状构件通过固定的螺旋弹簧将这些应力施加在其中心区域上的晶片部分的突出部分上 通过适当形状的定心推力构件支撑并保持在适当的位置。 通过在超高真空环境中平移装置并将与上部位置的可下降构件接合的锁定杆与固定凸轮进行对比来实现弹起。