公开(公告)号：EP0162521A3

公开(公告)日：1986-10-08

申请号：EP85200770

申请日：1985-05-14

申请人： AMERICAN MICROSYSTEMS, INCORPORATED

发明人： Cooley, Richard F.

IPC分类号： H01L23/04 ,  H01L23/48

CPC分类号： H01L23/49827 ,  H01L23/057 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/10161 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15312 ,  H01L2924/16195 ,  H01L2924/19041 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A programmable package for integrated circuits includes a ground plane, a power plane and a plurality of electrically isolated but conductive fingers and a multiplicity ofterminals on the exterior of the package. A selected number of fingers handling selected I/O signals are connected directly to the multiplicity of terminals on the package exterior. Additional fingers are available within the package connected to a ground plane or to a power plane or to an I/0 plane. The result is a package in which the particular terminals connected to external power and ground and handling I/O signals can be programmed in accordance with the needs of the circuit and the arrangement of the bonding pads on the die.

摘要翻译： 用于集成电路的可编程封装包括接地平面，电源平面和多个电隔离但导电的指状物以及封装外部的多个端子。 处理所选I / O信号的选定数量的手指直接连接到外包装上的多个终端。 附加的手指在连接到接地平面或电源平面或I / O平面的封装内可用。 结果是其中可以根据电路的需要和芯片上的焊盘的布置编程连接到外部电源和接地和处理I / O信号的特定端子的封装。

公开(公告)号：EP0162521A2

公开(公告)日：1985-11-27

申请号：EP85200770.7

申请日：1985-05-14

申请人： AMERICAN MICROSYSTEMS, INCORPORATED

发明人： Cooley, Richard F.

IPC分类号： H01L23/04 ,  H01L23/48

CPC分类号： H01L23/49827 ,  H01L23/057 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/10161 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15312 ,  H01L2924/16195 ,  H01L2924/19041 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A programmable package for integrated circuits includes a ground plane, a power plane and a plurality of electrically isolated but conductive fingers and a multiplicity ofterminals on the exterior of the package. A selected number of fingers handling selected I/O signals are connected directly to the multiplicity of terminals on the package exterior. Additional fingers are available within the package connected to a ground plane or to a power plane or to an I/0 plane. The result is a package in which the particular terminals connected to external power and ground and handling I/O signals can be programmed in accordance with the needs of the circuit and the arrangement of the bonding pads on the die.

摘要翻译： 用于集成电路的可编程封装包括接地平面，电源平面和多个电隔离但导电的指状物以及封装外部的多个端子。 处理所选I / O信号的选定数量的手指直接连接到外包装上的多个终端。 附加的手指在连接到接地平面或电源平面或I / O平面的封装内可用。 结果是其中可以根据电路的需要和芯片上的焊盘的布置编程连接到外部电源和接地和处理I / O信号的特定端子的封装。