公开(公告)号：EP1638135A3

公开(公告)日：2008-03-19

申请号：EP05019177.4

申请日：2005-09-03

申请人： ASM INTERNATIONAL N.V.

发明人： Van Den Berg, Jannes Remco ,  Grannemann, Ernst H.A.

IPC分类号： H01L21/00

CPC分类号： H01L21/67109 ,  C30B31/14 ,  H01L21/67306 ,  H01L21/68742

摘要： Susceptors plates are formed having a minimum surface roughness. The wafer contact surfaces of the susceptor plates have a surface roughness Ra value of about 0.6 µm or more. The contact surface is otherwise flat and lacking in large protrusions. In addition, the susceptors have a low transparency to more closely match the heat absorption properties of the supported wafer. Advantageously, heat transfer from the susceptors to the wafers is highly uniform. Thus, using these susceptors to support the wafers during high temperature semiconductor processing ( e.g. , at > 1000°C) results in no or few crystallographic slip lines being formed on the wafers.

公开(公告)号：EP1638135A2

公开(公告)日：2006-03-22

申请号：EP05019177.4

申请日：2005-09-03

申请人： ASM INTERNATIONAL N.V.

发明人： Van Den Berg, Jannes Remco ,  Grannemann, Ernst H.A.

IPC分类号： H01L21/00

CPC分类号： H01L21/67109 ,  C30B31/14 ,  H01L21/67306 ,  H01L21/68742

摘要： Susceptors plates are formed having a minimum surface roughness. The wafer contact surfaces of the susceptor plates have a surface roughness Ra value of about 0.6 µm or more. The contact surface is otherwise flat and lacking in large protrusions. In addition, the susceptors have a low transparency to more closely match the heat absorption properties of the supported wafer. Advantageously, heat transfer from the susceptors to the wafers is highly uniform. Thus, using these susceptors to support the wafers during high temperature semiconductor processing ( e.g. , at > 1000°C) results in no or few crystallographic slip lines being formed on the wafers.

摘要翻译： 形成具有最小表面粗糙度的感受器板。 基座板的晶片接触面的表面粗糙度Ra值为约0.6μm以上。 接触表面是平坦的，并且没有大的突起。 此外，感受体具有低透明度以更紧密地匹配被支撑晶片的吸热性能。 有利地，从基座到晶片的热传递是高度均匀的。 因此，在高温半导体处理（例如，> 1000℃）下使用这些基座来支撑晶片导致晶片上没有形成或几乎没有形成晶体学滑移线。