公开(公告)号：EP4425259A1

公开(公告)日：2024-09-04

申请号：EP23159066.2

申请日：2023-02-28

申请人： ASML Netherlands B.V.

发明人： WIGGERS, Frank, Bert ,  LUDWIG, Heike ,  ALLSOP, Nicholas, Alan ,  WARMING, Till ,  HALM, Simon

IPC分类号： G03F7/00 ,  H01L21/683 ,  H01L21/687

CPC分类号： G03F7/70708 ,  G03F7/7095

摘要： The invention provides a method of manufacturing an electrostatic object clamp for a semiconductor processing apparatus, the method comprising the steps of:
- providing an electrode with a dielectric substrate,
- depositing a coating on a top surface of the dielectric substrate by alternatingly depositing:
- one or more electrically conductive base layers, and
- one or more electrically conductive protective layers, and

- laser ablating the coating to form one or more recesses in the coating to obtain a three-dimensional coating structure, and
- removing all areas of the one or more protective layers that are exposed after the step of laser ablating.