公开(公告)号：EP1871157A2

公开(公告)日：2007-12-26

申请号：EP07104681.7

申请日：2007-03-22

Applicant: ASUSTeK Computer Inc.

Inventor： Wang, Ching-Jen

IPC: H05K9/00

CPC classification number: H05K9/0028 ,  H01R13/6586 ,  H01R13/6594 ,  H05K1/0218 ,  H05K9/0039 ,  H05K2201/10189 ,  H05K2201/10371 ,  H05K2201/10515

Abstract: This invention discloses an EMI shielding module installed on the circuit board with at least one connection hole. This EMI shielding module includes a shielding case and at least one protrusion. The shielding case capped on the device is arranged on the circuit board. The protrusion is arranged on the shielding case and inserted in the connection hole. Therefore, the shielding case is grounded by connecting it to the circuit board with the protrusion inserted in the connection hole.

Abstract translation: 本发明公开了一种安装在具有至少一个连接孔的电路板上的EMI屏蔽模块。 该EMI屏蔽模块包括屏蔽壳和至少一个突起。 装在设备上的屏蔽壳体布置在电路板上。 突起部布置在屏蔽壳体上并插入连接孔中。 因此，屏蔽壳体通过将突起插入连接孔中而将其连接到电路板而接地。

公开(公告)号：EP1871157A3

公开(公告)日：2009-12-09

申请号：EP07104681.7

申请日：2007-03-22

Applicant: ASUSTeK Computer Inc.

Inventor： Wang, Ching-Jen

IPC: H05K9/00

CPC classification number: H05K9/0028 ,  H01R13/6586 ,  H01R13/6594 ,  H05K1/0218 ,  H05K9/0039 ,  H05K2201/10189 ,  H05K2201/10371 ,  H05K2201/10515

Abstract: This invention discloses an EMI shielding module installed on the circuit board with at least one connection hole. This EMI shielding module includes a shielding case and at least one protrusion. The shielding case capped on the device is arranged on the circuit board. The protrusion is arranged on the shielding case and inserted in the connection hole. Therefore, the shielding case is grounded by connecting it to the circuit board with the protrusion inserted in the connection hole.

Abstract translation: 本发明公开了一种安装在电路板上的EMI屏蔽模块，其具有至少一个连接孔。 该EMI屏蔽模块包括屏蔽壳体和至少一个突起。 电路板上设置有盖在设备上的屏蔽壳。 突起布置在屏蔽壳体上并插入连接孔中。 因此，通过将突起插入连接孔中而将屏蔽壳体连接到电路板而将屏蔽壳体接地。