公开(公告)号：EP3396441A1

公开(公告)日：2018-10-31

申请号：EP16875284.8

申请日：2016-11-08

Applicant: Omron Corporation

Inventor： KAWAI, Wakahiro ,  BESSHO, Takafumi

IPC: G02F1/1333 ,  G02F1/13 ,  G02F1/1345 ,  G09F9/00 ,  H01L25/16

CPC classification number: G02F1/13452 ,  G02F1/13 ,  G02F1/1333 ,  G02F1/1345 ,  H01L21/565 ,  H01L24/96 ,  H01L2224/04105 ,  H01L2224/16227 ,  H01L2224/24137 ,  H01L2224/24195 ,  H01L2924/14 ,  H01L2924/15192 ,  H01L2924/15323 ,  H01L2924/16251 ,  H01L2924/1815 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/3025 ,  H05K1/092 ,  H05K1/181 ,  H05K1/185 ,  H05K3/12 ,  H05K3/284 ,  H05K3/32 ,  H05K2201/09118 ,  H05K2201/09236 ,  H05K2201/10128 ,  H05K2201/10136 ,  H05K2201/10371 ,  H05K2201/10507 ,  H05K2203/1316 ,  H05K2203/1327 ,  H05K2203/1469

Abstract: Provided are an electronic device and a manufacturing method therefor such that, when connecting a first electronic component configured to have a step near an external connection terminal to a second electronic component via wiring, the size increase of a manufacturing device can be avoided, wiring can be carried out at a low-cost, and the reliability of the wiring connections can be improved. An LCD (10) and an IC (20) are embedded and exposed in a resin molding (30) in such a manner that a connection electrode (13a) of the LCD (10) and an electrode of the IC (20) are positioned on the same plane.

公开(公告)号：EP3200226A4

公开(公告)日：2017-09-27

申请号：EP14904131

申请日：2014-10-17

Applicant: HUAWEI TECH CO LTD

Inventor： LI XIAOQING ,  JIANG JINJING ,  ZHANG ZHIGUO ,  WANG BIN

IPC: H01L23/40 ,  H01L23/36 ,  H01L23/42 ,  H05K9/00

CPC classification number: H05K1/0203 ,  C09J9/02 ,  C09J2201/128 ,  C09J2201/602 ,  C09J2203/326 ,  H01L23/36 ,  H01L23/3675 ,  H01L23/42 ,  H01L23/552 ,  H01L2924/0002 ,  H05K1/0212 ,  H05K9/0009 ,  H05K9/0032 ,  H05K2201/10371 ,  H01L2924/00

Abstract: The present invention discloses a heat-dissipation and shielding structure, including a shielding case, a thermal pad, and a heat sink. The bottom of the shielding case is connected to a circuit board used to carry a heat emitting element, the heat sink is disposed on the top of the shielding case, the top of the shielding case is provided with an opening, the thermal pad runs through the opening, a bottom surface of the thermal pad is attached to the heat emitting element, and a top surface of the thermal pad is attached to the heat sink; and the heat-dissipation and shielding structure further includes a metal spring plate, where the metal spring plate is located on a periphery of the opening and encircles the opening, and the metal spring plate is elastically connected between the shielding case and the heat sink, so that the heat sink and the shielding case together form a shielding enclosure encircling the heat emitting element. The heat-dissipation and shielding structure disclosed in the present invention has good heat-dissipation and shielding functions.

Abstract translation: 本发明公开了一种散热屏蔽结构，包括屏蔽壳，散热垫和散热片。 屏蔽壳体的底部连接有用于承载发热元件的电路板，散热器设置在屏蔽壳体的顶部，屏蔽壳体的顶部设有开口，热垫贯穿 所述开口，所述导热垫的底表面附接到所述发热元件，并且所述导热垫的顶表面附接到所述散热器; 所述散热屏蔽结构还包括金属弹片，所述金属弹片位于所述开口的周边并围绕所述开口，所述金属弹片弹性连接于所述屏蔽壳与所述散热片之间， 使得散热器和屏蔽罩一起形成围绕发热元件的屏蔽罩。 本发明公开的散热屏蔽结构具有良好的散热和屏蔽功能。

公开(公告)号：EP3196980A1

公开(公告)日：2017-07-26

申请号：EP16199054.4

申请日：2016-11-16

Applicant: Samsung Electronics Co., Ltd. ,  Pocons Co., Ltd.

Inventor： SONG, Byoung-ryoul ,  SUNG, Eui-suck

IPC: H01R4/48 ,  H01R4/64 ,  H01R12/75 ,  H05K5/00 ,  H05K3/32 ,  H01R12/79 ,  H05K5/02 ,  H05K9/00 ,  H05K1/02 ,  H05K3/40

CPC classification number: H05K1/181 ,  H01R4/48 ,  H01R13/6594 ,  H05K1/0215 ,  H05K3/301 ,  H05K3/325 ,  H05K3/4015 ,  H05K9/0032 ,  H05K2201/10189 ,  H05K2201/10356 ,  H05K2201/10371 ,  H05K2201/10393

Abstract: An electronic device (101) is provided which includes a printed circuit board (1100) including a non-conductive layer that forms at least a portion of a first surface (1102), and a conductive layer (1104) arranged between the first surface and a second surface, an electronic component (1190) arranged on a first area (1101) of the first surface of the PCB, a conductive shield structure (1300) arranged on the PCB to cover the first area and the electronic component on the PCB, a support structure (1600) connected to the PCB and including a first part (1610) that faces a portion of one side of the conductive shield structure, and a cable (1400) extending along the one side of the conductive shield structure, inserted between the support structure and the portion of the one side of the conductive shield structure, and including at least one conductive line (1401,1402) and an insulation layer (1403,1404) that covers the at least one conductive line.

Abstract translation: 提供了一种电子设备（101），其包括：印刷电路板（1100），其包括形成第一表面（1102）的至少一部分的非导电层和布置在第一表面和第一表面之间的导电层（1104） 第二表面，布置在PCB的第一表面的第一区域（1101）上的电子部件（1190），布置在PCB上以覆盖PCB上的第一区域和电子部件的导电屏蔽结构（1300） 支撑结构（1600），其连接到所述PCB并且包括面对所述导电屏蔽结构的一侧的一部分的第一部分（1610）和沿着所述导电屏蔽结构的所述一侧延伸的电缆（1400），所述电缆插入 所述支撑结构和所述导电屏蔽结构的所述一侧的所述部分，并且包括至少一条导线（1401,1402）和覆盖所述至少一条导线的绝缘层（1403,1404）。

公开(公告)号：EP2671431B1

公开(公告)日：2017-07-12

申请号：EP11790988.7

申请日：2011-12-06

Applicant: ZF Friedrichshafen AG

Inventor： MAIER, Thomas

IPC: H05K1/14 ,  H05K1/18 ,  H05K1/02 ,  H05K3/32

CPC classification number: H05K1/141 ,  H05K1/0278 ,  H05K1/182 ,  H05K3/321 ,  H05K2201/10371

公开(公告)号：EP2187435B1

公开(公告)日：2017-04-12

申请号：EP09773081.6

申请日：2009-02-16

Applicant: Omron Corporation

Inventor： ONO, Kazuyuki ,  TANAKA, Yoshio ,  NAKAJIMA, Kiyoshi ,  KURATANI, Naoto ,  MAEKAWA, Tomofumi

IPC: H01L23/04 ,  H01L23/10 ,  H01L23/055 ,  H01L23/552 ,  H05K3/34

CPC classification number: H05K3/341 ,  H01L23/055 ,  H01L23/10 ,  H01L23/552 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/05554 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10162 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/16152 ,  H01L2924/16251 ,  H01L2924/16315 ,  H01L2924/1632 ,  H01L2924/3025 ,  H05K3/3452 ,  H05K2201/099 ,  H05K2201/10371 ,  Y02P70/613 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A package for storing a semiconductor element mounted on an upper surface of a substrate (52) is configured by a substrate (52) and a conductive cap (54). A grounding electrode (57) is annularly formed on an upper surface outer circumferential section of the substrate (52). An upper surface of an inner circumferential section of the grounding electrode (57) is covered with a solder resist (67). On an outer circumference lower end surface of the conductive cap (54), a flange (70) substantially horizontally bent is formed. The conductive cap (54) is arranged on the upper surface of the substrate (52), and a lower surface of the flange (70) is permitted to abut to an upper surface of the solder resist (67). Furthermore, on a further outer circumferential side from the solder resist (67), a space formed between the lower surface of the flange (70) and the grounding electrode (57) is filled with a conductive bonding member (73), and the conductive cap (54) is bonded to the substrate (52).

公开(公告)号：EP3090810A4

公开(公告)日：2017-03-08

申请号：EP15758770

申请日：2015-03-04

Applicant: HUAWEI DEVICE CO LTD

Inventor： MA FUQIANG ,  DING HAIXING

IPC: B05C11/10 ,  H05K3/30 ,  H05K5/06 ,  H05K9/00

CPC classification number: H05K13/0469 ,  H05K3/30 ,  H05K3/321 ,  H05K5/064 ,  H05K9/0028 ,  H05K2201/10371

Abstract: An embodiment of the present invention provides an auxiliary adhesive dispensing apparatus, where the auxiliary adhesive dispensing apparatus is connected to a PCB board through an opening on a side surface of a shielding cover above the PCB board, and the auxiliary adhesive dispensing apparatus includes: a flow guiding groove, an adhesive-injection opening connected to an end of the flow guiding groove, and a fixing part connecting the flow guiding groove and the PCB board. The auxiliary adhesive dispensing apparatus provided in this embodiment of the present invention is connected to a PCB board through an opening on a side surface of a shielding cover above the PCB board. By means of the auxiliary adhesive dispensing apparatus, an adhesive dispensing operation can still be performed after a shielding cover is mounted, so that the adhesive dispensing operation can be performed after second-reflow soldering processing. By means of the auxiliary adhesive dispensing apparatus, an adhesive dispensing operation is completed after second reflow soldering, and there is no more second reflow soldering after adhesive dispensing is complete, which can reduce risks of tin whisker bridging in a chip at which adhesive dispensing is performed and tin balls at a peripheral chip.

Abstract translation: 本发明实施例提供了一种辅助粘合剂分配装置，所述辅助粘合剂分配装置通过所述PCB板上方的屏蔽盖侧面开口与PCB板连接，所述辅助粘合剂分配装置包括： 导流槽，与导流槽一端连接的粘胶注入口以及连接导流槽和PCB板的固定部。 本发明实施例提供的辅助粘合剂分配装置通过PCB板上方屏蔽罩侧面的开口与PCB板连接。 借助于辅助粘合剂分配设备，粘合剂分配操作仍然可以在安装屏蔽盖之后执行，使得粘合剂分配操作可以在第二回流焊接处理之后执行。 借助于辅助粘合剂分配设备，粘合剂分配操作在第二次回流焊接之后完成，并且在粘合剂分配完成之后不再进行第二次回流焊接，这可以降低在粘合剂分配的芯片中桥接锡晶须的风险 在外围芯片上执行锡球。

公开(公告)号：EP3013126A1

公开(公告)日：2016-04-27

申请号：EP15190913.2

申请日：2015-10-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： BANG, Jung-Je ,  KIM, Mi-Jin ,  LEE, Sae-Bom ,  HAN, Hyun-Joo ,  KIM, Kun-Tak

IPC: H05K1/02 ,  H05K7/20 ,  H01L23/552 ,  H01L23/00 ,  H05K9/00 ,  H05K3/34

CPC classification number: H05K3/321 ,  H01L21/563 ,  H01L23/10 ,  H01L23/36 ,  H01L23/3737 ,  H01L23/42 ,  H01L23/4275 ,  H01L23/552 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/29194 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81815 ,  H01L2224/83191 ,  H01L2224/83855 ,  H01L2224/92125 ,  H01L2224/9221 ,  H01L2224/92225 ,  H01L2924/1421 ,  H01L2924/16152 ,  H01L2924/16235 ,  H01L2924/16251 ,  H01L2924/19105 ,  H01L2924/3025 ,  H05K1/0203 ,  H05K1/0216 ,  H05K1/023 ,  H05K3/341 ,  H05K3/3494 ,  H05K2201/066 ,  H05K2201/10371 ,  H05K2201/1056 ,  Y02P70/613 ,  H01L2924/00

Abstract: A method is provided for manufacturing a printed circuit board assembly. A method includes applying a liquefied radiant-heat material (40) on a heating component (P1) mounted on the printed circuit board (P); mounting a shield unit (41) on the printed circuit board in contact with the liquefied radiant-heat material; and simultaneously curing the liquefied radiant-heat material and bonding the shield unit.

Abstract translation: 提供了一种用于制造印刷电路板组件的方法。 一种方法包括在安装在印刷电路板（P）上的加热部件（P1）上应用液化辐射热材料（40） 将屏蔽单元（41）安装在与液化辐射热材料接触的印刷电路板上; 同时固化液化辐射热材料并粘合屏蔽单元。

公开(公告)号：EP2995179A1

公开(公告)日：2016-03-16

申请号：EP14788578.4

申请日：2014-03-13

Applicant: Parker-Hannifin Corporation

Inventor： BUNYAN, Michael, H. ,  TOROK, Peter, Z. ,  WATCHKO, George, R. ,  CZARNECKI, Jeffrey

IPC: H05K1/05

CPC classification number: H05K3/321 ,  H05K1/05 ,  H05K9/0083 ,  H05K9/009 ,  H05K2201/10371

Abstract: A method for providing EMI shielding to an electronic circuit board using an electrically-conductive thermoplastic sheet containing a pre-applied electrically- conductive adhesive composition is disclosed. The adhesive composition is fluent and form-stable, and comprises a silicone adhesive, a compatible silane and electrically-conductive particles or fibers. The adhesive is conveniently pre-applied to the thermoplastic sheet and shipped to the customer for attachment to the integrated circuit board.

公开(公告)号：EP2799181A4

公开(公告)日：2016-01-20

申请号：EP12861511

申请日：2012-12-25

Applicant: SENJU METAL INDUSTRY CO

Inventor： OHNISHI TSUKASA ,  YOSHIKAWA SHUNSAKU ,  ISHIBASHI SEIKO ,  FUJIMAKI REI

IPC: B23K35/26 ,  B23K1/00 ,  B23K35/02 ,  B23K35/14 ,  B23K101/40 ,  C22C13/00 ,  H01L23/373 ,  H01L23/42 ,  H01L23/552 ,  H01L27/00 ,  H05K1/02 ,  H05K3/34

CPC classification number: B23K35/262 ,  B23K35/0233 ,  B23K35/0244 ,  C22C13/00 ,  H01L23/3736 ,  H01L23/42 ,  H01L23/552 ,  H01L27/00 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K3/341 ,  H05K3/3463 ,  H05K2201/10371 ,  H01L2924/00

Abstract: Provided is a solder alloy having excellent wettability on both of a Cu surface and an Ni surface. The solder alloy has such an alloy composition that 0.6 to 0.9 mass% of Cu and 0.01 to 0.1 mass% of Al are contained, 0.02 to 0.1 mass% of Ti and/or 0.01 to 0.05 mass% of Co may be contained as required and the remainder is made up by Sn.

Abstract translation: 提供一种在Cu表面和Ni表面都具有优异的润湿性的焊料合金。 焊料合金具有这样的合金组成：根据需要可以含有0.6〜0.9质量％的Cu和0.01〜0.1质量％的Al，0.02〜0.1质量％的Ti和/或0.01〜0.05质量％的Co; 剩余部分由Sn组成。

公开(公告)号：EP2448377B1

公开(公告)日：2015-11-25

申请号：EP10792138.9

申请日：2010-06-23

Applicant: Kyocera Corporation

Inventor： NAKASHIMA,Shuzou

IPC: H05K1/02 ,  H01L23/02 ,  H01L23/13 ,  H05K3/00

CPC classification number: H05K3/0052 ,  H01L23/055 ,  H01L23/13 ,  H01L23/3121 ,  H01L24/97 ,  H01L2224/16225 ,  H01L2224/48227 ,  H01L2224/97 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15159 ,  H01L2924/1531 ,  H01L2924/16152 ,  H01L2924/16251 ,  H01L2924/16315 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19103 ,  H01L2924/3025 ,  H01L2924/351 ,  H05K2201/09036 ,  H05K2201/0909 ,  H05K2201/10371 ,  H05K2203/0195 ,  H05K2203/0228 ,  H01L2224/81 ,  H01L2224/85 ,  H01L2924/00