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公开(公告)号：EP1554414A2
公开(公告)日：2005-07-20
申请号：EP03816722.7
申请日：2003-08-05
IPC分类号： C23C18/31
CPC分类号： C25D5/14 , C23C18/1651 , C23C18/1653 , C23C18/52 , C23C18/54
摘要： The present invention provides an improved aqueous alkaline zincate solution comprising hydroxide ions, zinc ions, nickel ions and/or cobalt iron ions, copper ions, and at least one inhibitor containing one or more nitrogen atoms, sulfur atoms, or both nitrogen and sulfur atoms provided said nitrogen atoms are not present in an aliphatic amine or hydroxylamine. The present invention also relates to methods for depositing zincate coatings on aluminum and aluminum alloys comprising applying an immersion zincate coating on an aluminum or aluminum alloy substrates, optionally followed by plating the zincate coated aluminum or aluminum alloy substrate using an electroless or electrolytic metal plating solution.
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2.发明授权METALLIZATION OF NON-CONDUCTIVE SURFACES WITH SILVER CATALYST AND ELECTROLESS METAL COMPOSITIONS 有权非导电表面的银催化剂和力量金属地段组合物金属化
公开(公告)号：EP1453988B1
公开(公告)日：2011-06-08
申请号：EP02763729.7
申请日：2002-09-25
发明人： JOSHI, Nayan, H.
IPC分类号： C23C18/28
摘要： A method of forming a conductive metal layer on a non-conductive surface, including providing a non-conductive surface; contacting the non-conductive surface with an aqueous solution or mixture containing a stannous salt to form a sensitized surface; contacting the sensitized surface with an aqueous solution or mixture containing a silver salt having a pH in the range from about 5 to about 10 to form a catalyzed surface; and electroless plating the catalyzed surface by applying an electroless plating solution to the catalyzed surface.
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3.发明授权
公开(公告)号：EP0815292B1
公开(公告)日：2000-01-26
申请号：EP96907505.0
申请日：1996-03-15
IPC分类号： C25D5/54
CPC分类号： C25D5/54
摘要： The invention concerns a process for the selective or partial electrolytic metallization of surfaces of substrates made from electrically non-conducting materials which for the purpose of the coating process are secured to plastic-coated holding elements. The proposed process involves the following steps: a) preliminary treatment of the surfaces with an etching solution containing chromium (VI) oxide; followed immediately by b) treatment of the surfaces with a colloidal acidic solution of palladium-/zinc compounds, care being taken to prevent prior contact with adsorption-promoting solutions; c) treatment of the surfaces with a solution containing a soluble metal compound capable of being reduced by zinc (II) compounds, an alkali or alkaline earth metal hydroxide, and a complex forming agent for the metal in a quantity sufficient at least to prevent precipitation of metal hydroxides; d) treatment of the surfaces with an electrolytic metallization solution. By applying this process, it is possible to ensure that only the surfaces of the work piece are coated with metal, not the holding elements or, where applicable, non-conductive plastic layers applied to parts of the work pieces. In addition, the process facilitates direct electrolytic metallization even of large plastic surfaces without prior currentless metallization.
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4.发明公开
公开(公告)号：EP2800785A1
公开(公告)日：2014-11-12
申请号：EP13704088.7
申请日：2013-02-11
发明人： JOSHI, Nayan, H. , CARVER, Kerri Little , PATENA, Thomas Anthony , RINGHOLZ, Christopher George
IPC分类号： C09D9/00
摘要： The invention relates to a non-aqueous stripping composition for removing cured organic paint from substrates comprising i. a source of hydroxide ions; ii. a high-boiling alcohol having a boiling point of at least 100°C; and iii. at least one surfactant represented by the following formula R - O - (CH
2 CH
2 O)
n H and wherein R is an alkyl chain, linear or branched having a 2 to 24 carbon atom chain length.摘要翻译： 本发明涉及的非水剥离组合物用于从基材，其包含i除去有机固化涂料。 氢氧根离子源; II。 具有至少100℃的沸点的高沸点醇。 和iii。 由下式R-O-（CH2CH2O）nH的和worin R表示的至少一种表面活性剂是烷基链，直链或支链的具有2至24个碳原子的链长度。
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5.发明公开METALLIZATION OF NON-CONDUCTIVE SURFACES WITH SILVER CATALYST AND ELECTROLESS METAL COMPOSITIONS 有权非导电表面的银催化剂和力量金属地段组合物金属化
公开(公告)号：EP1453988A2
公开(公告)日：2004-09-08
申请号：EP02763729.7
申请日：2002-09-25
发明人： JOSHI, Nayan, H.
IPC分类号： C23C18/28
摘要： A method of forming a conductive metal layer on a non-conductive surface, including providing a non-conductive surface; contacting the non-conductive surface with an aqueous solution or mixture containing a stannous salt to form a sensitized surface; contacting the sensitized surface with an aqueous solution or mixture containing a silver salt having a pH in the range from about 5 to about 10 to form a catalyzed surface; and electroless plating the catalyzed surface by applying an electroless plating solution to the catalyzed surface.
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6.发明公开
公开(公告)号：EP0815292A1
公开(公告)日：1998-01-07
申请号：EP96907505.0
申请日：1996-03-15
IPC分类号： C25D5
CPC分类号： C25D5/54
摘要： The invention concerns a process for the selective or partial electrolytic metallization of surfaces of substrates made from electrically non-conducting materials which for the purpose of the coating process are secured to plastic-coated holding elements. The proposed process involves the following steps: a) preliminary treatment of the surfaces with an etching solution containing chromium (VI) oxide; followed immediately by b) treatment of the surfaces with a colloidal acidic solution of palladium-/zinc compounds, care being taken to prevent prior contact with adsorption-promoting solutions; c) treatment of the surfaces with a solution containing a soluble metal compound capable of being reduced by zinc (II) compounds, an alkali or alkaline earth metal hydroxide, and a complex forming agent for the metal in a quantity sufficient at least to prevent precipitation of metal hydroxides; d) treatment of the surfaces with an electrolytic metallization solution. By applying this process, it is possible to ensure that only the surfaces of the work piece are coated with metal, not the holding elements or, where applicable, non-conductive plastic layers applied to parts of the work pieces. In addition, the process facilitates direct electrolytic metallization even of large plastic surfaces without prior currentless metallization.
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