公开(公告)号：EP3144771B1

公开(公告)日：2018-09-12

申请号：EP16185982.2

申请日：2016-08-26

申请人： Acer Incorporated

发明人： Wang, Yung-Chih ,  Ke, Jau-Han ,  LIAO, Wen-Neng ,  HSIEH, Cheng-Wen

IPC分类号： G06F1/20 ,  F28F13/08 ,  F28D15/02

CPC分类号： F28D15/025 ,  F28D15/02 ,  F28D15/0266 ,  F28D2021/0028 ,  F28F1/006 ,  F28F13/08 ,  G06F1/203 ,  H05K7/20336

摘要： A heat dissipation module used for an electronic device is provided. The electronic device has a heat source. The heat dissipation module includes an evaporator, a pipe, and a working fluid. The evaporator thermally contacts the heat source and absorbs heat generated from the heat source. The evaporator has a chamber connected to the pipe to form a loop, and the working fluid is filled in the loop. A structure of the chamber located at a connection portion between the chamber and the pipe gradually converges towards the pipe in relation to other structure of the chamber.

公开(公告)号：EP3144772A1

公开(公告)日：2017-03-22

申请号：EP16186964.9

申请日：2016-09-02

申请人： Acer Incorporated

发明人： Wang, Yung-Chih ,  Ke, Jau-Han ,  LIAO, Wen-Neng ,  HSIEH, Cheng-Wen

IPC分类号： G06F1/20

摘要： A heat dissipation module used for an electronic device is provided. The electronic device has a heat source. The heat dissipation module includes an evaporator, a pipe, and a working fluid. The evaporator thermally contacts the heat source and absorbs heat generated from the heat source. The evaporator has a chamber connected to the pipe to form a loop, and the working fluid is filled in the loop. A structure of the chamber located at a connection portion between the chamber and the pipe gradually converges towards the pipe in relation to other structure of the chamber.

摘要翻译： 提供了一种用于电子设备的散热模块。 电子设备具有热源。 散热模块包括蒸发器，管道和工作流体。 蒸发器热接触热源并吸收从热源产生的热量。 蒸发器具有连接到管道的腔室以形成环路，并且工作流体填充在环路中。 位于腔室和管子之间的连接部分处的室的结构相对于腔室的其它结构逐渐朝向管道会聚。

公开(公告)号：EP3144772B1

公开(公告)日：2020-11-11

申请号：EP16186964.9

申请日：2016-09-02

申请人： Acer Incorporated

发明人： Wang, Yung-Chih ,  Ke, Jau-Han ,  LIAO, Wen-Neng ,  HSIEH, Cheng-Wen

IPC分类号： G06F1/20

公开(公告)号：EP3144771A1

公开(公告)日：2017-03-22

申请号：EP16185982.2

申请日：2016-08-26

申请人： Acer Incorporated

发明人： Wang, Yung-Chih ,  Ke, Jau-Han ,  LIAO, Wen-Neng ,  HSIEH, Cheng-Wen

IPC分类号： G06F1/20

CPC分类号： F28D15/025 ,  F28D15/02 ,  F28D15/0266 ,  F28D2021/0028 ,  F28F1/006 ,  F28F13/08 ,  G06F1/203 ,  H05K7/20336

摘要： A heat dissipation module used for an electronic device is provided. The electronic device has a heat source. The heat dissipation module includes an evaporator, a pipe, and a working fluid. The evaporator has a recess at an exterior surface of the evaporator, and the heat source is thermally contacted with the recess to transfer a heat generated from the heat source to the recess of the evaporator. The pipe is connected to an inner space of the evaporator and forms a loop. The working fluid is filled in the loop, wherein the working fluid in liquid passing through a portion of the inner space of the evaporator corresponding to the recess absorbs the heat and is transformed into vapor.

摘要翻译： 提供一种用于电子设备的散热模块。 电子设备具有热源。 散热模块包括蒸发器，管道和工作流体。 蒸发器在蒸发器的外表面具有凹部，并且热源与凹部热接触以将热源产生的热量传递到蒸发器的凹部。 管道连接到蒸发器的内部空间并形成回路。 工作流体填充在环路中，其中通过蒸发器的内部空间的与凹部对应的一部分的液体中的工作流体吸收热量并转化成蒸汽。