公开(公告)号：EP3360204A1

公开(公告)日：2018-08-15

申请号：EP16854059.9

申请日：2016-09-15

申请人： Advanced Micro Devices, Inc.

发明人： HENG, Stephen, F. ,  HARDIKAR, Mahesh, S. ,  DANDIA, Sanjay

IPC分类号： H01R12/51 ,  H01R12/00 ,  H01R4/64 ,  H01R13/518

CPC分类号： H01R12/88 ,  H01R12/7076 ,  H01R43/205 ,  H05K3/32 ,  H05K7/1007

摘要： Various apparatus and methods of electrically connecting a packaged integrated circuit to a circuit board are disclosed. In one aspect, an apparatus includes a first frame to be mounted on the circuit board and having a first end. An insulating housing is adapted to be mounted on the circuit board and positioned in the first frame. A second frame is pivotally coupled to the first frame. The second frame includes two spaced-apart rail members and a cross member coupled to and between the rail members opposite the first end of the second frame. The rail members are operable to receive the packaged integrated circuit. The second frame has at least one engagement member to engage a first portion of the insulating housing when the second frame is pivoted toward the insulating housing. A third frame is pivotally coupled to the first frame to apply force to the packaged integrated circuit.