公开(公告)号：EP3388876A1

公开(公告)日：2018-10-17

申请号：EP18159675.0

申请日：2018-03-02

申请人： Google LLC

发明人： LIU, Hong ,  URATA, Ryohei ,  KWON, Woon Seong ,  KANG, Teckgyu

IPC分类号： G02B6/42 ,  B60C13/02 ,  B60C23/18

CPC分类号： G02B6/428 ,  B60C13/02 ,  B60C23/18 ,  G02B6/4243 ,  H01L24/17 ,  H01L24/81 ,  H01L25/167 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2924/1426 ,  H05K1/11 ,  H05K1/18 ,  H05K3/301 ,  H05K3/32 ,  H05K2201/10121 ,  H05K2201/10378

摘要： Signal integrity in high-speed applications is dependent on both the underlying device performance and electronic packaging methods. The maturity of chip-on-board (COB) packaging technology using wire bonding makes it a cost beneficial option for the mass production of high-speed optical transceivers. However, wire bonding introduces parasitic inductance associated with the length of the bond wires that limits the scalability of the system for higher data throughput. A high-speed optical transceiver package according to a first proposed configuration minimizes packaging related parasitic inductance by vertically integrating components using flip-chip bonding. A high-speed optical transceiver package according to a second proposed configuration minimizes packaging related parasitic inductance with horizontal tiling of components using a chip carrier and flip-chip bonding.

公开(公告)号：EP2618429B1

公开(公告)日：2018-08-08

申请号：EP12305061.9

申请日：2012-01-17

申请人： Nexans

发明人： Riedel, Richard ,  Völkl, Dietmar ,  Bock, Norbert ,  Wagner, Johannes

IPC分类号： H01R12/62 ,  H01R43/02 ,  H01R4/02

CPC分类号： H01R13/58 ,  H01R4/023 ,  H01R4/027 ,  H01R12/592 ,  H01R12/62 ,  H01R43/0256 ,  H05K3/32 ,  H05K3/328 ,  H05K3/34 ,  Y10T29/49147

公开(公告)号：EP3351065A1

公开(公告)日：2018-07-25

申请号：EP16845819.8

申请日：2016-09-16

申请人： At&S (China) Co., Ltd.

发明人： TAY, Annie ,  BAUER-OEPPINGER, Nikolaus ,  DI GREGORIO, Giordano ,  DAI, Philips

IPC分类号： H05K3/46

CPC分类号： H05K3/4682 ,  H05K1/0269 ,  H05K3/0097 ,  H05K3/022 ,  H05K3/108 ,  H05K3/32 ,  H05K3/4007 ,  H05K2201/068 ,  H05K2201/09918 ,  H05K2201/09936 ,  H05K2203/0156 ,  H05K2203/0264

摘要： A semifinished product with a sacrificial structure and two component carriers releasably formed on opposing main surfaces of the sacrificial structure. The sacrificial structure includes a central structure and releasing layers on or over both opposing main surfaces of the central structure The central structure includes a dummy core being covered, in particular fully, on or over both main surfaces thereof with a respective one of two spatially separated sections of separate material, in particular separate dielectric material.

公开(公告)号：EP3329749A2

公开(公告)日：2018-06-06

申请号：EP16770968.2

申请日：2016-07-27

申请人： Sevcon Limited

发明人： BARRASS, Peter ,  JACKSON, Matt

IPC分类号： H05K1/02 ,  H05K1/05 ,  H05K1/14 ,  H05K3/00 ,  H05K3/36

CPC分类号： H05K1/0204 ,  H05K1/0209 ,  H05K1/056 ,  H05K1/144 ,  H05K1/18 ,  H05K3/0061 ,  H05K3/32 ,  H05K3/368 ,  H05K2201/042 ,  H05K2201/066 ,  H05K2201/10409 ,  H05K2201/10598 ,  H05K2201/2036

摘要： A power electronics assembly for an electric motor controller. The power electronics assembly comprises an insulated metal substrate, a composite material substrate, and a bolt having a bolt head and a bolt shaft for mechanically coupling the composite material substrate to the insulated metal substrate. The power electronics assembly also includes an electrically conductive sleeve configured to be held between a first electrical contact carried by the insulated metal substrate and a second electrical contact carried by the composite material substrate and the bolt is configured to clamp the composite material substrate to the insulated metal substrate to force the electrically conductive sleeve against the first electrical contact and the second electrical contact.

公开(公告)号：EP3328171A1

公开(公告)日：2018-05-30

申请号：EP17202912.6

申请日：2017-11-21

申请人： G-Smatt Co., Ltd.

发明人： Kim, Sung Soo ,  Lee, Young Woo ,  Lee, Ho Joon

IPC分类号： H05K3/36 ,  H01R12/62 ,  H05K3/46 ,  H05K1/02 ,  H05K3/32

CPC分类号： H05K1/0393 ,  G09F13/08 ,  H05K1/0274 ,  H05K1/09 ,  H05K1/147 ,  H05K3/32 ,  H05K3/323 ,  H05K3/361 ,  H05K3/4691 ,  H05K2201/0108 ,  H05K2201/09145 ,  H05K2201/09409 ,  H05K2201/10106 ,  H05K2201/10128 ,  H05K2201/2009 ,  H05K2203/0285

摘要： Disclosed are a durable flexible circuit board for a transparent display board and an assembling method of the flexible circuit board. The flexible circuit board is connected between a driver board provided with at least one of a power supply and a controller and a transparent plate provided with a plurality of light emitting elements. The flexible circuit board includes an electrode bonding portion provided with a plurality of signal connection terminals for transferring control signals, at least one power connection terminal for transferring electric power, and at least one dummy terminal disposed outside the signal connection terminal or the power connection terminal disposed at the outermost side. The dummy terminal resists vibration and pressure applied to the signal connection terminal or the power connection terminal disposed at the outermost side. The signal connection terminal and the power connection terminal are integrated in the flexible circuit board.

公开(公告)号：EP3306812A1

公开(公告)日：2018-04-11

申请号：EP16803250.6

申请日：2016-05-27

申请人： Mitsuba Corporation

发明人： KOSHIO Fumiaki ,  OGANE Takahiko ,  KUSUMOTO Wataru ,  ISHII Masamichi

IPC分类号： H02P29/00 ,  H02K5/22 ,  H02K11/33 ,  H05K3/32

CPC分类号： H02K11/33 ,  H02K5/225 ,  H02K9/22 ,  H02K11/02 ,  H02K11/30 ,  H02K29/08 ,  H02P6/28 ,  H02P29/00 ,  H05K3/32

摘要： A control apparatus (3) includes a terminal (4) that includes a plurality of electrically conductive plate materials (100), a base member (5) on which the terminal (4) is provided, and an electronic component (6) that includes a plurality of electronic elements (60) which are electrically connected to the terminal (4), wherein a window part (55) from which part of the terminal (4) is exposed is formed on the base member (5) so as to penetrate in a thickness direction of the base member (5), and an extension electronic component arrangement part (55k) is provided on the base member (5), and wherein the electronic component (6) is electrically connected to the terminal (4) that is exposed from the window part (55), and an electronic component (6) is electrically connectable selectively between a plurality of bus bars (100) by the extension electronic component arrangement part (55k).

摘要翻译： 本发明提供一种控制装置（3），该控制装置（3）包括：具有多个导电性板材（100）的端子（4）;设置有端子（4）的基座部件（5）;以及电子部件 与所述端子（4）电连接的多个电子元件（60），其中所述端子（4）的一部分从其露出的窗口部分（55）形成在所述基底构件（5）上以贯穿 （5）的厚度方向上延伸，并且在所述基座部件（5）上设置有延伸电子部件配置部（55k），所述电子部件（6）与所述端子（4）电连接，所述端子 从所述窗部（55）露出，通过所述延长用电子部件配置部（55k），能够在多个母线（100）之间选择性地电连接电子部件（6）。

公开(公告)号：EP3305042A1

公开(公告)日：2018-04-11

申请号：EP16725137.0

申请日：2016-05-26

申请人： Valeo Vision

发明人： HUE, David ,  ZOJCESKI, Zdravko

IPC分类号： H05K1/18 ,  H05K3/30

CPC分类号： H05K3/32 ,  H05K1/0284 ,  H05K3/107 ,  H05K3/185 ,  H05K3/305 ,  H05K2201/09118 ,  H05K2201/10106 ,  H05K2203/1469

摘要： The invention proposes a moulded interconnection device (MID) comprising at least one electronic component, for example a light-emitting diode (LED) light source. The electrical and mechanical connections between the light source and the conductive tracks of the MID do not have intermetallic interfaces and are more durable relative to known devices. The invention also proposes a method for assembling a light source on an MID during the production of the latter. Since all of the steps of the method can be carried out at ambient temperature, the risk of damage to the components used is diminished.

公开(公告)号：EP3154729A4

公开(公告)日：2018-02-28

申请号：EP15806611

申请日：2015-06-12

申请人： ALPHA METALS

发明人： GHOSHAL SHAMIK ,  KUMAR V SATHISH ,  VISHWANATH PAVAN ,  PANDHER RANJIT S ,  CHANDRAN REMYA ,  MUKHERJEE SUTAPA ,  SARKAR SIULI ,  SINGH BAWA ,  BHATKAL RAVINDRA MOHAN

IPC分类号： B22F1/02 ,  B22F3/10 ,  B22F5/00 ,  B22F7/02 ,  B22F7/04 ,  B23K35/02 ,  B23K35/30 ,  C22C1/04 ,  H01L23/00 ,  H05K1/09

CPC分类号： B22F1/0044 ,  B22F1/02 ,  B22F3/1017 ,  B22F3/22 ,  B22F5/006 ,  B22F7/04 ,  B22F2007/047 ,  B22F2301/255 ,  B22F2999/00 ,  B23K1/0016 ,  B23K3/0607 ,  B23K35/0244 ,  B23K35/3006 ,  B23K2201/40 ,  H01L21/6835 ,  H01L21/78 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L24/84 ,  H01L24/85 ,  H01L24/94 ,  H01L24/95 ,  H01L24/97 ,  H01L2221/68313 ,  H01L2221/68368 ,  H01L2224/04026 ,  H01L2224/05155 ,  H01L2224/05639 ,  H01L2224/11003 ,  H01L2224/11009 ,  H01L2224/111 ,  H01L2224/11332 ,  H01L2224/11334 ,  H01L2224/11438 ,  H01L2224/1144 ,  H01L2224/11505 ,  H01L2224/11848 ,  H01L2224/13139 ,  H01L2224/13294 ,  H01L2224/13295 ,  H01L2224/13311 ,  H01L2224/13324 ,  H01L2224/13339 ,  H01L2224/13347 ,  H01L2224/13355 ,  H01L2224/13363 ,  H01L2224/1338 ,  H01L2224/13384 ,  H01L2224/13387 ,  H01L2224/1339 ,  H01L2224/13393 ,  H01L2224/13411 ,  H01L2224/13439 ,  H01L2224/13444 ,  H01L2224/13455 ,  H01L2224/13464 ,  H01L2224/13469 ,  H01L2224/1349 ,  H01L2224/16227 ,  H01L2224/27002 ,  H01L2224/27003 ,  H01L2224/27009 ,  H01L2224/271 ,  H01L2224/27312 ,  H01L2224/2732 ,  H01L2224/27332 ,  H01L2224/27334 ,  H01L2224/27438 ,  H01L2224/2744 ,  H01L2224/27505 ,  H01L2224/2782 ,  H01L2224/27821 ,  H01L2224/27848 ,  H01L2224/29139 ,  H01L2224/29294 ,  H01L2224/29295 ,  H01L2224/29311 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29363 ,  H01L2224/29364 ,  H01L2224/2938 ,  H01L2224/29384 ,  H01L2224/29387 ,  H01L2224/2939 ,  H01L2224/29393 ,  H01L2224/29411 ,  H01L2224/29439 ,  H01L2224/29444 ,  H01L2224/29455 ,  H01L2224/29464 ,  H01L2224/29469 ,  H01L2224/2949 ,  H01L2224/2969 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45014 ,  H01L2224/75251 ,  H01L2224/75316 ,  H01L2224/7598 ,  H01L2224/81002 ,  H01L2224/81191 ,  H01L2224/8184 ,  H01L2224/81948 ,  H01L2224/83002 ,  H01L2224/83191 ,  H01L2224/83193 ,  H01L2224/83439 ,  H01L2224/83444 ,  H01L2224/83447 ,  H01L2224/8384 ,  H01L2224/83948 ,  H01L2224/94 ,  H01L2224/95 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/0463 ,  H01L2924/0503 ,  H01L2924/05032 ,  H01L2924/20105 ,  H01L2924/20106 ,  H01L2924/20107 ,  H01L2924/20108 ,  H01L2924/20109 ,  H01L2924/2011 ,  H01L2924/2064 ,  H05K3/32 ,  H05K2203/1131 ,  B22F1/0018 ,  B22F1/025 ,  H01L2224/11 ,  H01L2924/00012 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2224/27 ,  H01L2924/01046 ,  H01L2924/01029 ,  H01L2924/01042 ,  H01L2924/01028 ,  H01L2924/0105 ,  H01L2924/01006 ,  H01L2924/01005 ,  H01L2224/45015 ,  H01L2924/207

摘要： Methods for die attachment of multichip and single components including flip chips may involve printing a sintering paste on a substrate or on the back side of a die. Printing may involve stencil printing, screen printing, or a dispensing process. Paste may be printed on the back side of an entire wafer prior to dicing, or on the back side of an individual die. Sintering films may also be fabricated and transferred to a wafer, die or substrate. A post-sintering step may increase throughput.

公开(公告)号：EP3278639A1

公开(公告)日：2018-02-07

申请号：EP16771460.9

申请日：2016-04-01

申请人： Tacto Tek OY

发明人： HEIKKINEN, Mikko ,  SÄÄSKI, Jarmo

IPC分类号： H05K5/00 ,  H05K5/06 ,  H05K1/18 ,  H05K3/28 ,  B29C45/16 ,  B29L31/34

CPC分类号： H05K1/186 ,  H05K1/0274 ,  H05K1/028 ,  H05K1/0298 ,  H05K1/189 ,  H05K3/12 ,  H05K3/284 ,  H05K3/32 ,  H05K2201/0129 ,  H05K2201/10106 ,  H05K2201/10121 ,  H05K2203/1316 ,  H05K2203/1327

摘要： A multilayer structure for an electronic device, includes a flexible substrate film (202, 502) for accommodating electronics, a number of electronic components (308, 508) provided on a first surface area (401A, 501A) of the film, the film also including a second surface area adjacent (401B, 501B) to the first surface area, and a number of conductive traces (412, 512) printed on the substrate film for electrically connecting electronic components together, wherein the number of electronic components and the related first surface area of the substrate accommodating the components have been overmolded with first thermoplastic material (306, 506), the adjacent second surface area and at least part of the first area being overmolded with second thermoplastic material so that at least part of the electronic components and the first thermoplastic material thereon are substantially embedded between the substrate film and second thermoplastic material. A corresponding method of manufacture is presented.

公开(公告)号：EP3270443A1

公开(公告)日：2018-01-17

申请号：EP17174808.0

申请日：2017-06-07

申请人： General Electric Company

发明人： KAPUSTA, Christopher James ,  NAGARKAR, Kaustubh Ravindra

IPC分类号： H01M2/20 ,  H01M10/04 ,  H01M10/42 ,  H01L23/58 ,  H01L23/00 ,  H01M10/052 ,  H01M10/0562 ,  H01M10/0587 ,  H01M6/40

CPC分类号： H05K1/185 ,  H01L21/486 ,  H01L21/565 ,  H01L23/3121 ,  H01L23/5383 ,  H01L23/5384 ,  H01L23/5389 ,  H01L23/58 ,  H01L23/66 ,  H01L24/19 ,  H01L24/20 ,  H01L24/32 ,  H01L24/83 ,  H01L2223/6677 ,  H01L2224/04105 ,  H01L2224/24137 ,  H01L2224/32225 ,  H01L2224/83192 ,  H01L2224/92144 ,  H01L2924/1421 ,  H01L2924/1461 ,  H01M2/20 ,  H01M6/40 ,  H01M10/0436 ,  H01M10/052 ,  H01M10/0562 ,  H01M10/0585 ,  H01M10/0587 ,  H01M10/425 ,  H01M2220/30 ,  H05K1/0298 ,  H05K1/115 ,  H05K3/32 ,  H05K3/4038 ,  H05K2201/10037 ,  H05K2201/10098 ,  H05K2201/10151 ,  H05K2203/1316 ,  H05K2203/1327

摘要： A system and method for providing a packaged electronics module (10) having a dry film battery (18) incorporated therein is disclosed. The packaged electronics module (10) includes a first dielectric layer (20), at least one electronic component (12, 14, 16) attached to or embedded in the first dielectric layer (20), a dry film battery (18) formed on the first dielectric layer (20), and metal interconnects (40) mechanically and electrically coupled to the at least one electronic component (12, 14, 16) and the dry film battery (18) to form electrical interconnections thereto. Electronic components (12, 14, 16) in the form of a MEMS type sensor (12), semiconductor device (14) and communications device (16) may be included in the module along with the battery (18) to provide a self-powered module capable of communicating with other like packaged electronics modules.

摘要翻译： 公开了一种用于提供具有并入其中的干膜电池（18）的封装电子模块（10）的系统和方法。 所述封装的电子模块（10）包括第一介电层（20），至少一个附着到或嵌入第一介电层（20）中的电子部件（12,14,16），干膜电池（18） 所述第一介电层（20）和金属互连（40）机械和电耦合到所述至少一个电子部件（12,14,16）和所述干膜电池（18）以形成电互连。 MEMS型传感器（12），半导体装置（14）和通信装置（16）形式的电子组件（12,14,16）可与电池（18）一起被包括在模块中， 能够与其他类似封装的电子模块进行通信。