Hydrogen fluxless soldering by electron attachment
    2.
    发明公开
    Hydrogen fluxless soldering by electron attachment 有权
    FlussmittelfreiesLötenmit Wasserstoff mittels Zugabe von Elektronen

    公开(公告)号:EP1291111A1

    公开(公告)日:2003-03-12

    申请号:EP02019722.4

    申请日:2002-09-03

    IPC分类号: B23K1/20 H05K3/34

    CPC分类号: H05K3/3489 B23K1/20 B23K1/206

    摘要: The present invention is a method of dry fluxing metal surfaces of one or more components to be soldered, comprising the steps of: a) providing one or more components (4) to be soldered which are connected to a first electrode (3) as a target assembly; b) providing a second electrode adjacent (2) the target assembly; c) providing a gas mixture (6) comprising a reducing gas between the first and second electrodes; d) providing a direct current (DC) voltage to the first and second electrodes (2,3) and donating electrons to the reducing gas to form negatively charged ionic reducing gas; e) contacting the target assembly with the negatively charged ionic reducing gas and reducing oxides on the target assembly.

    摘要翻译: 本发明是一种要焊接的一种或多种组分的干熔剂金属表面的方法,包括以下步骤:a)提供一个或多个待焊接的组件(4),其连接到第一电极(3)作为 目标装配; b)提供邻近(2)目标组件的第二电极; c)在第一和第二电极之间提供包含还原气体的气体混合物(6); d)向所述第一和第二电极(2,3)提供直流(DC)电压并向所述还原气体提供电子以形成带负电荷的离子还原气体; e)使靶组件与负电荷的离子还原气体和目标组件上的还原氧化物接触。

    Apparatus for generating a negatively charged ionic reducing gas
    4.
    发明公开
    Apparatus for generating a negatively charged ionic reducing gas 有权
    用于产生带负电的离子还原气体的设备

    公开(公告)号:EP1775052A2

    公开(公告)日:2007-04-18

    申请号:EP07002567.1

    申请日:2004-04-27

    摘要: The present invention provides an apparatus for the dry fluxing of at least one component and/or solder surface via electron attachment. The apparatus generates a negatively charged ionic reducing gas and comprises:
    an enclosure defining an interior hollow wherein at least a portion of the enclosure comprises an anode (54) connected to a first voltage level;
    a magnetic coil (51) residing either within or outside of the interior hollow, wherein the magnetic coil (51) is connected to an energy source;
    a gas inlet (22, 56) and a gas outlet (23, 57) that is in fluid communication with the interior hollow; and
    a cathode (52) residing within the interior hollow and interposed between the gas inlet (22, 56) and the gas outlet (23, 57) wherein the cathode (52) is connected to a second voltage level which has a negative bias relative to the first voltage level.

    摘要翻译: 本发明提供了一种用于通过电子附着对至少一种组分和/或焊料表面进行干燥助熔的装置。 该设备产生带负电荷的离子还原气体并且包括:限定内部空腔的外壳,其中外壳的至少一部分包括连接到第一电压水平的阳极(54) (51),所述电磁线圈(51)位于所述内部空腔的内部或外部,其中所述电磁线圈(51)连接到能量源; 气体入口(22,56)和气体出口(23,57),所述气体入口与所述内部空腔流体连通; 以及位于所述内部空腔内并介于所述气体入口(22,56)和所述气体出口(23,57)之间的阴极(52),其中所述阴极(52)连接至具有负偏压相对的第二电压电平 到第一电压电平。

    Apparatus and method for removal of surface oxides via fluxless technique involving electron attachement and remote ion generation
    5.
    发明公开
    Apparatus and method for removal of surface oxides via fluxless technique involving electron attachement and remote ion generation 有权
    一种用于通过加入电子和远程离子产生的去除氧化物oberflächigem与无焊剂处理过程

    公开(公告)号:EP1473105A2

    公开(公告)日:2004-11-03

    申请号:EP04010009.1

    申请日:2004-04-27

    摘要: The present invention provides a method and apparatus for the dry fluxing of at least one component (25) and/or solder surface via electron attachment. In one embodiment, there is provided a method for removing oxides from the surface of a component (25) comprising: providing a component (25) on a substrate (24) wherein the substrate (25) is grounded or has a positive electrical potential to form a target assembly; passing a gas mixture (26) comprising a reducing gas through an ion generator (21) comprising a first and a second electrode; supplying an amount of voltage to at least one of the first and second electrodes sufficient to generate electrons wherein the electrons attach to at least a portion of the reducing gas and form a negatively charged reducing gas; and contacting the target assembly (24) with the negatively charged reducing gas to reduce the oxides on the component (25).

    摘要翻译: 本发明提供了用于至少一个部件(25)和/或焊料的表面通过电子附着的干式助熔的方法和装置。 在一个,实施例提供了一种方法,用于从一个部件的表面除去氧化物(25),包括:在基片(24)worin衬底提供一部件(25)(25)被接地或具有正的电势,以 形成目标组件; 在离子发生器(21),包括第一和第二电极使包含还原气体的气体混合物(26)通过; 到足以产生电子worin电子附着到还原性气体中的至少一部分,并形成带负电的还原气体的第一和第二电极中的至少一个电压的量的供给; 和带负电荷的还原气体接触的目标组件(24),以减少部件(25)上的氧化物。

    Apparatus for generating a negatively charged ionic reducing gas
    7.
    发明公开
    Apparatus for generating a negatively charged ionic reducing gas 有权
    Verwendung einer Vorrichtung zur Erzeugung eines negativ geladenen reduzierenden Ionengases

    公开(公告)号:EP1775053A2

    公开(公告)日:2007-04-18

    申请号:EP07002568.9

    申请日:2004-04-27

    摘要: The present invention provides an apparatus for the dry fluxing of at least one component and/or solder surface via electron attachment. The apparatus generates a negatively charged ionic reducing gas and comprises:
    a first chamber (44) comprising: at least two electrodes wherein a bias in electrical potential is applied between the at least two electrodes; a first gas inlet (42) to receive a reducing gas; and a gas outlet to release the negatively charged ionic reducing gas; and
    a second chamber (43) which encloses the first chamber (44) and comprises a second gas inlet (41) to receive a carrier gas wherein the second gas inlet (41) is in fluid communication with the first chamber (44) and the reducing gas and the carrier gas form a gas mixture within the first chamber (44).

    摘要翻译: 本发明提供一种用于通过电子附件干燥熔化至少一种组分和/或焊料表面的设备(40)。 装置(40)产生带负电荷的离子还原气体,包括:第一室(44),包括:至少两个电极,其中在所述至少两个电极之间施加电势偏置; 用于接收还原气体的第一气体入口(42) 和气体出口以释放带负电荷的离子还原气体; 以及封闭所述第一室(44)并且包括第二气体入口(41)以接纳载气的第二室(43),其中所述第二气体入口(41)与所述第一室(44)流体连通,并且所述第二室 还原气体和载气在第一室(44)内形成气体混合物。