摘要:
The present invention is a method of dry fluxing metal surfaces of one or more components to be soldered, comprising the steps of: a) providing one or more components (4) to be soldered which are connected to a first electrode (3) as a target assembly; b) providing a second electrode adjacent (2) the target assembly; c) providing a gas mixture (6) comprising a reducing gas between the first and second electrodes; d) providing a direct current (DC) voltage to the first and second electrodes (2,3) and donating electrons to the reducing gas to form negatively charged ionic reducing gas; e) contacting the target assembly with the negatively charged ionic reducing gas and reducing oxides on the target assembly.
摘要:
The present invention provides an apparatus for the dry fluxing of at least one component and/or solder surface via electron attachment. The apparatus generates a negatively charged ionic reducing gas and comprises: an enclosure defining an interior hollow wherein at least a portion of the enclosure comprises an anode (54) connected to a first voltage level; a magnetic coil (51) residing either within or outside of the interior hollow, wherein the magnetic coil (51) is connected to an energy source; a gas inlet (22, 56) and a gas outlet (23, 57) that is in fluid communication with the interior hollow; and a cathode (52) residing within the interior hollow and interposed between the gas inlet (22, 56) and the gas outlet (23, 57) wherein the cathode (52) is connected to a second voltage level which has a negative bias relative to the first voltage level.
摘要:
The present invention provides a method and apparatus for the dry fluxing of at least one component (25) and/or solder surface via electron attachment. In one embodiment, there is provided a method for removing oxides from the surface of a component (25) comprising: providing a component (25) on a substrate (24) wherein the substrate (25) is grounded or has a positive electrical potential to form a target assembly; passing a gas mixture (26) comprising a reducing gas through an ion generator (21) comprising a first and a second electrode; supplying an amount of voltage to at least one of the first and second electrodes sufficient to generate electrons wherein the electrons attach to at least a portion of the reducing gas and form a negatively charged reducing gas; and contacting the target assembly (24) with the negatively charged reducing gas to reduce the oxides on the component (25).
摘要:
The present invention provides an apparatus for the dry fluxing of at least one component and/or solder surface via electron attachment. The apparatus generates a negatively charged ionic reducing gas and comprises: a first chamber (44) comprising: at least two electrodes wherein a bias in electrical potential is applied between the at least two electrodes; a first gas inlet (42) to receive a reducing gas; and a gas outlet to release the negatively charged ionic reducing gas; and a second chamber (43) which encloses the first chamber (44) and comprises a second gas inlet (41) to receive a carrier gas wherein the second gas inlet (41) is in fluid communication with the first chamber (44) and the reducing gas and the carrier gas form a gas mixture within the first chamber (44).
摘要:
An apparatus and a method comprising same for removing metal oxides from a substrate surface are disclosed herein. In one particular embodiment, the apparatus comprises an electrode assembly that has a housing that is at least partially comprised of an insulating material and having an internal volume and at least one fluid inlet that is in fluid communication with the internal volume; a conductive base connected to the housing comprising a plurality of conductive tips that extend therefrom into a target area and a plurality of perforations that extend therethrough and are in fluid communication with the internal volume to allow for a passage of a gas mixture comprising a reducing gas.