公开(公告)号：EP3089844A1

公开(公告)日：2016-11-09

申请号：EP14877119.9

申请日：2014-12-31

申请人： Alpha Metals, Inc.

发明人： RIBAS, Morgana, De Avila ,  RAUT, Rahul ,  CUCU, Traian, Cornel ,  YONG, Shu, Tai ,  SARKAR, Siuli ,  VENKATAGIRIYAPPA, Ramakrishna Hosur

IPC分类号： B23K35/362

摘要： Rosin-free thermosetting flux formulations for enhancing the mechanical reliability of solder joints. In accordance with one or more aspects, a solder paste as shown and described herein imparts improved or enhanced solder joint properties relating to at least one of drop shock, thermal cycling, thermal shock, shear strength, flexural strength performance, and/or other thermal-mechanical performance attributes.