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公开(公告)号：EP3038790A1
公开(公告)日：2016-07-06
申请号：EP14759052.5
申请日：2014-08-29
申请人： Alpha Metals, Inc.
发明人： PANDHER, Ranjit , SINGH, Bawa , RAUT, Rahul , SANYOGITA, Arora , BHATKAL, Ravindra , MO, Bin
IPC分类号： B23K35/26 , B23K35/36 , B23K35/362 , B23K35/02
CPC分类号： B23K35/3612 , B23K1/012 , B23K1/085 , B23K1/19 , B23K35/025 , B23K35/262 , B23K35/3613 , B23K35/362 , C22C13/00
摘要： A flux comprising one or more amines which is especially useful as a solder flux in soldering operations involving reactive metals such as aluminum; and a process for making aluminium surfaces solderable using the flux and conventional solders.
摘要翻译： 包含一种或多种胺的焊剂，其特别可用作焊料操作中涉及反应性金属如铝的焊剂; 以及使用焊剂和常规焊料使铝表面可焊的工艺。
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公开(公告)号：EP3089844A1
公开(公告)日：2016-11-09
申请号：EP14877119.9
申请日：2014-12-31
申请人： Alpha Metals, Inc.
发明人： RIBAS, Morgana, De Avila , RAUT, Rahul , CUCU, Traian, Cornel , YONG, Shu, Tai , SARKAR, Siuli , VENKATAGIRIYAPPA, Ramakrishna Hosur
IPC分类号： B23K35/362
摘要： Rosin-free thermosetting flux formulations for enhancing the mechanical reliability of solder joints. In accordance with one or more aspects, a solder paste as shown and described herein imparts improved or enhanced solder joint properties relating to at least one of drop shock, thermal cycling, thermal shock, shear strength, flexural strength performance, and/or other thermal-mechanical performance attributes.
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公开(公告)号：EP3068576A1
公开(公告)日：2016-09-21
申请号：EP13897342.5
申请日：2013-11-12
申请人： Alpha Metals, Inc.
发明人： PUJARI, Narahari , ARORA, Sanyogita , SARKAR, Siuli , LIFTON, Anna , RAUT, Rahul , SINGH, Bawa
CPC分类号： H05K3/3489 , B23K35/3612 , B23K35/3613 , B23K35/362 , H05K3/282 , H05K3/3478 , H05K2201/0133 , H05K2203/0514
摘要： Flux formulations that remain pliable and tack- free after deposition are disclosed. In certain examples, the flux comprises a first component and an effective amount of a second component to provide a pliable flux after deposition. The flux may also include activators, plasticizers, surface active agents and other components.
摘要翻译： 公开了在沉积后保持柔韧性和粘性的助焊剂制剂。 在某些实例中，焊剂包括第一组分和有效量的第二组分，以在沉积后提供柔韧的焊剂。 助熔剂还可以包括活化剂，增塑剂，表面活性剂和其它组分。
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公开(公告)号：EP2739431A2
公开(公告)日：2014-06-11
申请号：EP12756541.4
申请日：2012-08-02
申请人： Alpha Metals, Inc.
发明人： DE AVILA RIBAS, Morgana , LODGE, Dominic , PANDHER, Ranjit , SINGH, Bawa , BHATKAL, Ravindra M , RAUT, Rahul , SARKAR, Siuli , CHATTOPADHYAY, Kamanio , NANDI, Proloy
摘要： A solder composition comprising a blend of a first powder component and a second powder component, wherein the first powder component is a first solder alloy and the second powder component is a second solder alloy or a metal.
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公开(公告)号：EP2911979A1
公开(公告)日：2015-09-02
申请号：EP13786715.6
申请日：2013-10-29
申请人： Alpha Metals, Inc.
发明人： PANDHER, Ranjit , KHASELEV, Oscar , BHATKAL, Ravi , RAUT, Rahul , SINGH, Bawa , RIBAS, Morgana , GHOSAL, Shamik , SARKAR, Siuli , MUKHERJEE, Sutapa , KUMAR, Sathish , CHANDRAN, Remya , VISHWANATH, Pavan , PACHAMUTHU, Ashok , BOUREGHDA, Monnir , DESAI, Nitin , LIFTON, Anna , CHAKI, Nirmalya Kumar
CPC分类号： C09K5/14 , B22F1/0011 , B22F1/0014 , B22F1/0018 , B22F1/0062 , B22F1/0074 , B22F1/02 , B22F2001/0066 , B82Y30/00 , C01G5/00 , C01P2002/72 , C01P2002/88 , C01P2004/04 , C01P2004/53 , C01P2004/61 , C01P2004/64 , C01P2006/22 , C01P2006/32 , C01P2006/40 , C09C1/62 , C09C3/08 , H01L2924/0002 , H01L2924/00
摘要： A sintering powder comprising: a particulate having a mean longest diameter of less than 10 microns, wherein at least some of the particles forming the particulate comprise a metal at least partially coated with a capping agent.
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