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公开(公告)号：EP3025371B1
公开(公告)日：2019-06-19
申请号：EP13745323.9
申请日：2013-07-26
申请人： Analogic Corporation
IPC分类号： H01L27/146
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公开(公告)号：EP3570327A3
公开(公告)日：2020-02-19
申请号：EP19174596.7
申请日：2013-07-26
申请人： Analogic Corporation
IPC分类号： H01L27/146
摘要： Among other things, a detector unit for a detector array of a radiation imaging modality is provided. In some embodiments, the detector unit comprises a radiation detection sub-assembly and an electronics sub-assembly. In some embodiments, at least some portions of the detector unit, such as the electronics sub-assembly, may be formed via a semiconductor fabrication technique. By way of example, an electronics sub-assembly may be formed via a semiconductor fabrication technique and may comprise electronic circuitry which is embedded in a molding compound. In some embodiments, such electronic circuitry may be electrically coupled together via electrically conductive traces and/or vias.
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3.发明公开DETECTOR UNIT FOR DETECTOR ARRAY OF RADIATION IMAGING MODALITY 审中-公开检测器组件STRAHLUNGSBILDGEBUNGSMODALITÄT的检测器装置
公开(公告)号：EP3025371A1
公开(公告)日：2016-06-01
申请号：EP13745323.9
申请日：2013-07-26
申请人： Analogic Corporation
IPC分类号： H01L27/146
CPC分类号： G01T1/244 , G01T1/2018 , H01L27/14618 , H01L27/14661 , H01L2224/16225
摘要： Among other things, a detector unit for a detector array of a radiation imaging modality is provided. In some embodiments, the detector unit comprises a radiation detection sub-assembly and an electronics sub-assembly. In some embodiments, at least some portions of the detector unit, such as the electronics sub-assembly, may be formed via a semiconductor fabrication technique. By way of example, an electronics sub-assembly may be formed via a semiconductor fabrication technique and may comprise electronic circuitry which is embedded in a molding compound. In some embodiments, such electronic circuitry may be electrically coupled together via electrically conductive traces and/or vias.
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公开(公告)号：EP3570327A2
公开(公告)日：2019-11-20
申请号：EP19174596.7
申请日：2013-07-26
申请人： Analogic Corporation
IPC分类号： H01L27/146
摘要： Among other things, a detector unit for a detector array of a radiation imaging modality is provided. In some embodiments, the detector unit comprises a radiation detection sub-assembly and an electronics sub-assembly. In some embodiments, at least some portions of the detector unit, such as the electronics sub-assembly, may be formed via a semiconductor fabrication technique. By way of example, an electronics sub-assembly may be formed via a semiconductor fabrication technique and may comprise electronic circuitry which is embedded in a molding compound. In some embodiments, such electronic circuitry may be electrically coupled together via electrically conductive traces and/or vias.
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