Method for etching transistor gates using a hardmask
    1.
    发明公开
    Method for etching transistor gates using a hardmask 失效
    Verfahren zurÄtzungdes Gates von Transistoren mit einer harten Maske

    公开(公告)号:EP0837497A2

    公开(公告)日:1998-04-22

    申请号:EP97307549.2

    申请日:1997-09-25

    IPC分类号: H01L21/321

    CPC分类号: H01L21/32135

    摘要: An etchant composition of nitrogen trifluoride and chlorine, preferably also including a passivation material such as hydrogen bromide, etches tungsten silicide-polysilicon gate layers with high selectivity to a thin underlying silicon oxide gate oxide layer to form straight wall, perpendicular profiles with low microloading and excellent profile control.

    摘要翻译: 三氯化氮和氯的蚀刻剂组合物,优选还包括钝化材料如溴化氢,蚀刻钨硅化物 - 多晶硅栅极层,其具有对薄的底层氧化硅栅极氧化物层的高选择性,以形成具有低微载荷的直壁,垂直剖面, 优秀的档案控制。