摘要:
A method and system to form a refractory metal layer on a substrate features nucleating a substrate using sequential deposition techniques in which the substrate is serially exposed to first and second reactive gases followed by forming a layer, employing vapor deposition, to subject the nucleation layer to a bulk deposition of a compound contained in one of the first and second reactive gases. The process may be carried-out where all process steps occur in a common chamber or may occur in different chambers. For example, nucleation may be carried-out in a processing chamber that is different from the processing chamber in which the bulk deposition occurs. Also disclosed is a technique for controlling the presence of fluorine atoms in the resulting layer as a function of the carrier gas employed during nucleation.