公开(公告)号：EP0809278A2

公开(公告)日：1997-11-26

申请号：EP97303400.2

申请日：1997-05-19

申请人： APPLIED MATERIALS, INC.

发明人： Wytman, Joe

IPC分类号： H01L21/00

CPC分类号： H01L21/68742 ,  H01L21/67103 ,  H01L21/68785 ,  H01L21/68792 ,  Y10S414/135

摘要： A heating and lifting mechanism (50) for positioning a semiconductor wafer within a processing chamber (54) is provided including a pedestal (58) for supporting the wafer within the process chamber, a drive shaft (64) extending downwardly from a lower region of the pedestal and exhibiting a lead screw (98) at a distal portion thereof, and a drive mechanism (90), which is coaxial with the drive shaft, for providing linear vertical translation of the shaft and pedestal. The device also includes a CONFLAT® assembly (66) located between the pedestal and drive shaft. The CONFLAT® assembly includes upper and lower substantially flat planar plates (68,70) removably connected to one another. The upper plate is connected to a lower region of the pedestal, and the lower plate is connected to an upper end of the drive shaft. The CONFLAT® assembly permits removal of the heater pedestal without removing the entire lift assembly.

摘要翻译： 提供一种用于将半导体晶片定位在处理室（54）内的加热和提升机构（50），其包括用于将晶片支撑在处理室内的基座（58），从下部区域向下延伸的驱动轴（64） 所述基座在其远端部分呈现导螺杆（98），以及与所述驱动轴同轴的驱动机构（90），用于提供所述轴和基座的线性垂直平移。 该装置还包括位于基座和驱动轴之间的CONFLAT TM组件（66）。 CONFLAT TM组件包括可拆卸地彼此连接的上和下基本平坦的平板（68,70）。 上板连接到基座的下部区域，下板连接到驱动轴的上端。 CONFLAT TM组件允许移除加热器底座而不拆卸整个升降组件。

公开(公告)号：EP0834907A2

公开(公告)日：1998-04-08

申请号：EP97307707.6

申请日：1997-09-30

申请人： Applied Materials, Inc.

发明人： Wytman, Joe

IPC分类号： H01L21/00

CPC分类号： H01L21/67748 ,  H01L21/67757 ,  Y10S414/137 ,  Y10S414/139 ,  Y10S414/14

摘要： A dual stage load lock (10) is provided for transfer of semiconductor wafers (W) between an environment at atmospheric pressure and a high vacuum environment, such as a wafer processing system. The dual stage load lock includes a first load lock chamber (12) and a second load lock chamber (14) separated by a dividing ledge (20) which extends a distance inwardly from the inner wall of the load lock assembly. The lower load lock chamber selectively communicates with a transfer chamber (100) of the processing system, and is maintained at high vacuum. The upper load lock chamber selectively communicates with the external environment at atmospheric pressure. Therefore, the environment of the upper load lock chamber may vary between atmospheric pressure, when wafers are transferred between the load lock and the outside environment, and high vacuum, when the wafers are transferred between the first and second chambers of the load lock. The load lock may include modular chamber segments that can be arranged in a variety of configurations. A method for transferring wafers through the load lock is also provided.

摘要翻译： 提供了一种双级负载锁（10），用于在大气压的环境和诸如晶片处理系统的高真空环境之间传送半导体晶片（W）。 双级负载锁包括第一负载锁定室（12）和第二负载锁定室（14），所述第一负载锁定室（12）由分隔凸缘（20）分开，所述分隔凸缘从所述负载锁定组件的内壁向内延伸一定距离。 下部加载锁定室选择性地与处理系统的传送室（100）连通，并保持在高真空度。 上部负载锁定室在大气压下选择性地与外部环境连通。 因此，当晶片在负载锁的第一和第二室之间转移时，上部负载锁定室的环境可以在大气压力之间，当晶片在负载锁定和外部环境之间传递时产生高真空。 负载锁定可以包括可以以各种配置布置的模块化室段。 还提供了通过负载锁转移晶片的方法。

公开(公告)号：EP0809278A3

公开(公告)日：2003-05-02

申请号：EP97303400.2

申请日：1997-05-19

申请人： APPLIED MATERIALS, INC.

发明人： Wytman, Joe

IPC分类号： H01L21/00

CPC分类号： H01L21/68742 ,  H01L21/67103 ,  H01L21/68785 ,  H01L21/68792 ,  Y10S414/135

摘要： A heating and lifting mechanism (50) for positioning a semiconductor wafer within a processing chamber (54) is provided including a pedestal (58) for supporting the wafer within the process chamber, a drive shaft (64) extending downwardly from a lower region of the pedestal and exhibiting a lead screw (98) at a distal portion thereof, and a drive mechanism (90), which is coaxial with the drive shaft, for providing linear vertical translation of the shaft and pedestal. The device also includes a CONFLAT® assembly (66) located between the pedestal and drive shaft. The CONFLAT® assembly includes upper and lower substantially flat planar plates (68,70) removably connected to one another. The upper plate is connected to a lower region of the pedestal, and the lower plate is connected to an upper end of the drive shaft. The CONFLAT® assembly permits removal of the heater pedestal without removing the entire lift assembly.

公开(公告)号：EP0834907A3

公开(公告)日：2001-03-14

申请号：EP97307707.6

申请日：1997-09-30

申请人： Applied Materials, Inc.

发明人： Wytman, Joe

IPC分类号： H01L21/00

CPC分类号： H01L21/67748 ,  H01L21/67757 ,  Y10S414/137 ,  Y10S414/139 ,  Y10S414/14

摘要： A dual stage load lock (10) is provided for transfer of semiconductor wafers (W) between an environment at atmospheric pressure and a high vacuum environment, such as a wafer processing system. The dual stage load lock includes a first load lock chamber (12) and a second load lock chamber (14) separated by a dividing ledge (20) which extends a distance inwardly from the inner wall of the load lock assembly. The lower load lock chamber selectively communicates with a transfer chamber (100) of the processing system, and is maintained at high vacuum. The upper load lock chamber selectively communicates with the external environment at atmospheric pressure. Therefore, the environment of the upper load lock chamber may vary between atmospheric pressure, when wafers are transferred between the load lock and the outside environment, and high vacuum, when the wafers are transferred between the first and second chambers of the load lock. The load lock may include modular chamber segments that can be arranged in a variety of configurations. A method for transferring wafers through the load lock is also provided.