公开(公告)号：EP2842676A1

公开(公告)日：2015-03-04

申请号：EP13182653.9

申请日：2013-09-02

申请人： Applied Materials Switzerland Sàrl

发明人： Chinoune, Youcef ,  Bornet, Frederic ,  Soubielle, Sebastien ,  Speyrer, John

IPC分类号： B23D57/00 ,  B28D5/04

CPC分类号： B23D57/0023 ,  B23D57/0069 ,  B28D5/045

摘要： A wire saw device for cutting semiconductor material is described. The wire saw device includes a tension modifier adapted to convert a first wire tension into a second wire tension. The tension modifier includes a first guide roller including an axis of rotation and a plurality of grooves being formed in an outer circumferential surface of the first guide roller and a second guide roller including a plurality of grooves being formed in an outer circumferential surface of the second guide roller. The first guide roller and the second guide roller are spaced apart from each other at a fixed distance. The second guide roller is pivotable around the axis of rotation of the first guide roller.

摘要翻译： 描述用于切割半导体材料的线锯装置。 线锯装置包括适于将第一线张力转换成第二线张力的张力调节器。 张力调节器包括：第一引导辊，其包括旋转轴线，多个槽形成在第一引导辊的外周面上;第二引导辊，其具有形成在第二引导辊的外周面的多个槽; 导辊。 第一引导辊和第二引导辊以固定距离彼此间隔开。 第二引导辊围绕第一导辊的旋转轴线枢转。