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    Photopolymerizable laminate
    2.
    发明公开
    Photopolymerizable laminate 无效
    光聚合的复合材料。

    公开(公告)号：EP0125862A2

    公开(公告)日：1984-11-21

    申请号：EP84303071.9

    申请日：1984-05-08

    申请人： Asahi Kasei Kogyo Kabushiki Kaisha

    发明人： Ai, Hideo ,  Ikeda, Akihiko ,  Sato, Jiro

    IPC分类号： G03C1/68

    CPC分类号： G03F7/027

    摘要： A photopolymerizable laminate comprising a photopolymerizable layer and a support layer, said photopolymerizable layer containing:

    (1) 5 to 95% by weight, based on the total weight of the photopolymerizable layer, of a binder comprising a vinyl polymer or a vinyl copolymer,
    (2) 95 to 5% by weight, based on the total weight of the photopolymerizable layer, of a monomeric component containing at least 50% by weight of at least one compound selected from the group consisting of the photopolymerizable unsaturated compounds represented by the formulae (A), (B) and (C) shown below and having a value of molecular weight/number of double bonds contained of 1000 or less, and
    (3) 0.01 to 30% by weight, based on the total weight of the photopolymerizable layer, of a photopolymerization initiator.

    A precursor of a low thermal stress polyimide and a photopolymerizable composition containing a polyimide precursor
    3.
    发明公开
    A precursor of a low thermal stress polyimide and a photopolymerizable composition containing a polyimide precursor 失效
    低热应力聚酰亚胺的前体和含有聚酰亚胺前体的可光聚合组合物

    公开(公告)号：EP0355927A3

    公开(公告)日：1991-07-31

    申请号：EP89202128.8

    申请日：1989-08-23

    申请人： Asahi Kasei Kogyo Kabushiki Kaisha

    发明人： Ai, Hideo ,  Takahashi, Hideaki

    IPC分类号： C08G73/10 ,  C08G73/12 ,  C08F283/04 ,  G03F7/26

    CPC分类号： C08G73/1085 ,  C08G73/10 ,  C08G73/1082 ,  G03F7/0387 ,  H05K1/0346 ,  H05K3/4644 ,  H05K3/4676

    摘要： Disclosed is a polyimide precursor comprising a specific polyamic acid ester, polyamic amide or polyamic acid salt structure derived from a tetracarboxylic acid compound and a diamine compound, which can be converted by heating to a polyimide having low thermal stress. By blending a specific form of this novel polyimide precursor which has an ethylenic double bond, with a photopolymerization initiator, an excellent photopolymerizable composition can be obtained. Not only this precursor but also the crosslinked precursor obtained by the photopolymerization of the photopolymerizable composition can be converted by heating to a polyimide resin which has low thermal expansion coefficient, high heat resistance, excellent mechanical properties and satisfactory adhesion to a substrate. Hence, the precursor and the photopolymerizable composition can advantageously be utilized in the production of electrical and electronic components.

    A precursor of a low thermal stress polyimide and a photopolymerizable composition containing a polyimide precursor
    4.
    发明公开
    A precursor of a low thermal stress polyimide and a photopolymerizable composition containing a polyimide precursor 失效
    前体以低的热电压和含有光聚合性组合物中的Polymidvorläufer的聚酰亚胺。

    公开(公告)号：EP0355927A2

    公开(公告)日：1990-02-28

    申请号：EP89202128.8

    申请日：1989-08-23

    申请人： Asahi Kasei Kogyo Kabushiki Kaisha

    发明人： Ai, Hideo ,  Takahashi, Hideaki

    IPC分类号： C08G73/10 ,  C08G73/12 ,  C08F283/04 ,  G03F7/26

    CPC分类号： C08G73/1085 ,  C08G73/10 ,  C08G73/1082 ,  G03F7/0387 ,  H05K1/0346 ,  H05K3/4644 ,  H05K3/4676

    摘要： Disclosed is a polyimide precursor comprising a specific polyamic acid ester, polyamic amide or polyamic acid salt structure derived from a tetracarboxylic acid compound and a diamine compound, which can be converted by heating to a polyimide having low thermal stress. By blending a specific form of this novel polyimide precursor which has an ethylenic double bond, with a photopolymerization initiator, an excellent photopolymerizable composition can be obtained. Not only this precursor but also the crosslinked precursor obtained by the photopolymerization of the photopolymerizable composition can be converted by heating to a polyimide resin which has low thermal expansion coefficient, high heat resistance, excellent mechanical properties and satisfactory adhesion to a substrate. Hence, the precursor and the photopolymerizable composition can advantageously be utilized in the production of electrical and electronic components.

    摘要翻译： 本发明公开了含有特定的聚酰胺酸酯，聚酰胺酰胺或聚酰胺酸盐结构从四羧酸化合物和二胺化合物，其可通过加热被转化为具有低的热应力的聚酰亚胺衍生的聚酰亚胺前体。 通过混合其必须乙烯性双键，具有光聚合引发剂本新颖聚酰亚胺前体的一种具体形式，优异的可光聚合组合物可制得。 不仅如此，但前体因此由光聚合性组合物的光聚合获得的交联前体可通过加热被转化为聚酰亚胺树脂具有低的热膨胀系数，高耐热性，优异的机械性能和良好的粘接性的底物。 因此，前体和所述可光聚合组合物可有利地在制造电气和电子部件的使用。

    Heat-resistant photoresist film
    6.
    发明公开
    Heat-resistant photoresist film 失效
    耐热胶片

    公开(公告)号：EP0254230A3

    公开(公告)日：1988-11-23

    申请号：EP87110407

    申请日：1987-07-17

    申请人： Asahi Kasei Kogyo Kabushiki Kaisha

    发明人： Ai, Hideo ,  Ikeda, Akihiko ,  Yokota, Kan-ichi

    IPC分类号： G03F07/10 ,  G03C01/68

    CPC分类号： G03F7/037

    摘要： A heat-resistant photoresist film comprising, as the essential components,
    (a) a polymer consisting of recurring units represented by the formula
    wherein
    X is a tetravalent C 6-30 carbocyclic group or heterocyclic group; Y is a divalent C 6-30 carbocyclic group or heterocyclic group;
    A is -COOR or -COO⊖R'⊕ wherein each of R and R' is a compound having a reactive carbon-carbon double bond; and A is in the position ortho or peri with respect to the Z group, said polymer being capable of transforming into a polymer having a thermal decomposition temperature of at least 350 °C and a glass transition temperature of at most 350 °C in the heat treatment; (b) a compound having a reactive carbon-carbon double bond; and (c) a photopolymerization initiator.

    Process for preparing polyamides
    8.
    发明公开
    Process for preparing polyamides 失效
    制备聚氨酯的方法

    公开(公告)号：EP0177793A3

    公开(公告)日：1988-07-20

    申请号：EP85111534

    申请日：1985-09-12

    申请人： Asahi Kasei Kogyo Kabushiki Kaisha

    发明人： Ai, Hideo ,  Ikeda, Akihiko ,  Matsuoka, Yoshio

    IPC分类号： C08G69/28 ,  C08G69/42 ,  C08G73/10

    CPC分类号： C08G73/1007 ,  C08G69/26 ,  C08G69/28 ,  C08G69/42

    摘要： A process for preparing polyamides which comprises polycondensing dicarboxylic acids having the following general formula and diamines by using carbodiimides as the condensing agent.
    wherein X is a group having a valence of (m+2), and C 6-20 carboxylic group, C 3-20 heterocyclic group, C 2-20 alkyl group, or C 2-20 alkenyl group, the group having at least one carbon-carbon double bond in the position of conjugating to carboxylic acid radical or the group having an α,β-unsaturated ketone structure;
    Y is-OR or-NRR' wherein R and R' each independently is C 5-20 carbocyclic group, C 1-20 heterocyclic group, C 1-20 alkyl group or substituted group thereof having at least one substituent selected from the group consisting of -OW (wherein W is C 1-12 alkyl group), C 2 - 12 saturated acyl group, C 2-12 saturated acyloxy group, C 2 - 12 saturated acylamino group, C 2 - 12 dialkylamino group, -SW (wherein W is the same as defined above), C 2 - 12 saturated acylthio group and C 3-12 group having at least one silicon atom; m is 0, 1 or 2; and -COY can be attached to any of the positions ortho, peri, and y with respect to the -COOH group.

    Heat-resistant photoresist film
    9.
    发明公开
    Heat-resistant photoresist film 失效
    WärmebeständigerPhotolackfilm。

    公开(公告)号：EP0254230A2

    公开(公告)日：1988-01-27

    申请号：EP87110407.1

    申请日：1987-07-17

    申请人： Asahi Kasei Kogyo Kabushiki Kaisha

    发明人： Ai, Hideo ,  Ikeda, Akihiko ,  Yokota, Kan-ichi

    IPC分类号： G03F7/037

    CPC分类号： G03F7/037

    摘要： A heat-resistant photoresist film comprising, as the essential components,

    (a) a polymer consisting of recurring units represented by the formula
    wherein

    X is a tetravalent C 6-30 carbocyclic group or heterocyclic group;
    Y is a divalent C 6-30 carbocyclic group or heterocyclic group;

    A is -COOR or -COO⊖R'⊕ wherein each of R and R' is a compound having a reactive carbon-carbon double bond; and
    A is in the position ortho or peri with respect to the Z group, said polymer being capable of transforming into a polymer having a thermal decomposition temperature of at least 350 °C and a glass transition temperature of at most 350 °C in the heat treatment;

    (b) a compound having a reactive carbon-carbon double bond; and
    (c) a photopolymerization initiator.

    摘要翻译： 一种耐热性光致抗蚀剂膜，其包含作为必要成分的（a）由式（CHEM）表示的重复单元构成的聚合物，其中X为杂环基的四价C 6-30碳环基; Y是二价C 6-30碳环基或杂环基; 其中R和R min各自为具有反应性碳 - 碳双键的化合物;其中R和R分别为具有反应性碳 - 碳双键的化合物。 并且A相对于Z基团位于邻位或邻近位置，所述聚合物能够转化成热分解温度为至少350℃，玻璃化转变温度至多350℃的聚合物 治疗; （b）具有反应性碳 - 碳双键的化合物; 和（c）光聚合引发剂。