摘要:
The present invention relates to a polyamide resin composition comprising polyamide (X) comprising a diamine unit containing 70 mol% or more of a metaxylylenediamine unit and a dicarboxylic acid unit and an alkali compound (A), wherein the following equations (1) to (3) are satisfied; 0.03 ‰¤ P
摘要:
A thermosetting resin composition excellent in dimensional stability during curing and adhesiveness, heat resistance, moist heat resistance, electrical insulating properties, flexibility, low dielectric properties and low dissipation factor properties after curing is provided. A thermosetting resin composition according to the present invention is a thermosetting resin composition containing a polyamide (A) made by polymerization of a polybasic acid monomer and a polyamine monomer and having a phenolic hydroxyl group on a side chain, and a compound (B) with a functionality of three or more that can react with the phenolic hydroxyl group. Monomers that form the polyamide (A) include a monomer having a phenolic hydroxyl group and a monomer having a hydrocarbon group with a carbon number of 20 to 60 (excluding an aromatic ring to which the phenolic hydroxyl group bonds) and having a cyclic structure with a carbon number of 5 to 10.
摘要:
The present invention relates to a method for providing resistance to phenolic yellowing, during storage, transportation and processing of polyamide articles, caused by the presence of phenolic compounds in plastic package materials. The phenolic yellowing resistance is obtained by adding a sulfonated reagent during polymerization of the polyamide and/or during the formation of the polyamide article, like melt-spinning extrusion, and/or during the conversion of the polyamide article by texturizing.
摘要:
Provided are [1] a xylylenediamine composition containing xylylenediamine and a compound represented by the following general formula (1), wherein the content of the compound represented by the general formula (1) is 0.001 to 0.1 parts by mass based on 100 parts by mass of the xylylenediamine; and a method for producing a polyamide resin including the steps of introducing a compound represented by the following general formula (1), a diamine including xylylenediamine (but excluding the compound represented by the general formula (1)), and a dicarboxylic acid into a reaction system and performing a polycondensation reaction, wherein the amount of the compound represented by the general formula (1) to be introduced is 0.001 to 0.1 parts by mass based on 100 parts by mass of the xylylenediamine, where, in the general formula (1), n and m each independently represent an integer of 0 to 6, excluding the case where n and m are both 1.
摘要:
The present invention relates to a process for making a hydrophilic polyamide without excessive foaming by delaying the introduction of the hydrophilic monomer. The hydrophilic monomer may be added to the polymerization process after at least a portion of the water has been removed from the process.