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    Method to produce a rod tag and tag produced by the method
    5.
    发明公开
    Method to produce a rod tag and tag produced by the method 有权
    这是通过该方法制备用于生产棒标记和标记的方法

    公开(公告)号：EP2615687A1

    公开(公告)日：2013-07-17

    申请号：EP12151321.2

    申请日：2012-01-16

    申请人： ASSA ABLOY AB

    发明人： Bielmann, Marc ,  Robadey, Jean-Miguel ,  Suligoj, Eric ,  Meilland, André ,  Monnard, Patrick ,  Defferrard, Joël

    IPC分类号： H01Q1/40 ,  H01Q1/42 ,  H01Q7/06 ,  H01Q1/22

    CPC分类号： H01Q7/08 ,  H01Q1/2225 ,  H01Q1/40 ,  H01Q1/42 ,  H01Q7/06 ,  H05K13/0023 ,  Y10T29/49018

    摘要： A method to produce a rod tag and tag produced according to the method, wherein the method comprises at least the steps of:
    - ) providing a magnetic core having a cylindrical shape and two end,
    - ) winding a wire around said core to form an antenna,
    - ) positioning in longitudinal extension a chip at one of the ends of said rod where the wound wire ends terminates,
    - ) bonding said wire ends to contacts of said chip,
    - ) displacing said bonded chip at least partially on said end of said rod,
    - ) introducing said core with said wire and said chip in an encapsulating means containing a stabilizing material, whereby the chip is further positioned on said end by the friction between said chip and said material during introduction.

    摘要翻译： 以产生雅丁到的方法制造的杆标签和标签的方法，worin该方法包括至少下列步骤： - ）提供的磁芯具有圆柱形形状和两个端部， - ）卷绕在所述芯体的导线形成在 天线， - 在纵向延伸）定位在其中该伤口线端部终止，所述杆的端部中的一个的芯片， - ）键合所述导线端连接到所述芯片的触点， - ）上的所述端部至少部分地移动所述接合芯片 所述杆， - ）将所述芯与有线和所述芯片中，以含有稳定材料，由此，芯片通过芯片和所述材料之间的摩擦引入期间进一步定位在所述端部封装装置。

    RFID TAG WITH A BOOSTER ANTENNA
    7.
    发明公开
    RFID TAG WITH A BOOSTER ANTENNA 审中-公开

    公开(公告)号：EP4036800A1

    公开(公告)日：2022-08-03

    申请号：EP22163776.2

    申请日：2020-02-04

    申请人： Assa Abloy AB

    发明人： Robadey, Jean-Miguel ,  MIRUS, Christian

    IPC分类号： G06K19/077 ,  H01R13/641 ,  H01R43/26

    摘要： The present disclosure relates an RFID tag (1) comprising a first component (2) provided with an integrated circuit (10) and a near-field antenna (3) being electrically connected to the integrated circuit (10), a second component (4) provided with a far-field antenna (5) and a pivoting mechanism (6) configured to allow pivoting of the first component (2) and the second component (4) from an open position, in which the first and second component (2, 4) are separated to a closed position, in which the integrated circuit (10) with near-field antenna (3) is inductively coupled with the far-field antenna (5) such that the integrated circuit (10) is readable not only in the near field RFID communication but also in the far field of RFID communication.

    RFID ear tag
    8.
    发明公开
    RFID ear tag 审中-公开
    RFID-Ohrmarke

    公开(公告)号：EP2848116A1

    公开(公告)日：2015-03-18

    申请号：EP14183362.4

    申请日：2014-09-03

    申请人： Assa Abloy AB

    发明人： Robadey, Jean-Miguel

    IPC分类号： A01K11/00

    摘要： The RFID tag part comprises at least a housing (2) to house a transponder (1), and a washer (3) to maintain said transponder in said housing first part.

    摘要翻译： RFID标签部分至少包括容纳应答器（1）的壳体（2）和用于将所述应答器保持在所述壳体第一部分中的垫圈（3）。

    Flexible tag
    9.
    发明公开
    Flexible tag 审中-公开
    灵活性Etikett

    公开(公告)号：EP2657889A2

    公开(公告)日：2013-10-30

    申请号：EP13163766.2

    申请日：2013-04-15

    申请人： Assa Abloy Ab

    发明人： Bielmann, Marc ,  Robadey, Jean-Miguel ,  Suligoj, Eric ,  Ennabli, Elies

    IPC分类号： G06K19/02 ,  G06K19/077

    CPC分类号： G06K19/07749 ,  G06K19/025 ,  G06K19/027 ,  G06K19/07728 ,  H01Q1/2225 ,  H01Q1/40 ,  Y10T29/49018

    摘要： A flexible Radio-Frequency IDentification (RFID) tag comprises a flexible substrate layer (4) on which is fixed an antenna (7) connected to a RFID chip (5), and a second flexible layer (6) placed directly over the said chip and antenna but without any direct mechanical connection to them, such that the substrate layer (4) and the second layer (6) form a protective inlay (3) for the chip (5) and the antenna (7). The said inlay is embedded in a flexible housing (1).

    摘要翻译： 灵活的射频识别（RFID）标签包括柔性基底层（4），固定在其上连接到RFID芯片（5）的天线（7）和直接放置在所述芯片上的第二柔性层（6） 和天线，但没有与它们的任何直接的机械连接，使得衬底层（4）和第二层（6）形成用于芯片（5）和天线（7）的保护性嵌体（3）。 所述嵌体嵌入柔性外壳（1）中。