公开(公告)号：EP2796019A1

公开(公告)日：2014-10-29

申请号：EP12805956.5

申请日：2012-11-27

申请人： Atotech Deutschland GmbH

发明人： MIRKOVIC, Marko ,  KLOBUS, Marcin ,  TONG, Terry ,  CHEN, Ted ,  TANG, Tiger ,  MOSER, Christoph

IPC分类号： H05K3/42 ,  C25D3/38 ,  C25D5/18 ,  H01L21/288 ,  C23C18/16

CPC分类号： H05K3/423 ,  C23C18/1653 ,  C25D3/38 ,  C25D5/02 ,  C25D5/18 ,  C25D7/00 ,  C25D7/123 ,  H05K3/424 ,  H05K2203/0789 ,  H05K2203/1476 ,  H05K2203/1492

摘要： The present invention relates to a method for copper electroplating in the manufacture of printed circuit boards, IC substrates and the like. Said method is suitable for a combined conformal through-hole (5) filling and filling of blind micro vias (6). The method utilizes a metal redox system and pulse reverse plating and involves a multilayer laminate comprising a dielectric core layer (1) having an inner copper layer (3), a dielectric outer layer (2) and an outer copper layer (4). A first copper layer (7) is formed by flash plating then copper (8) is electroplated by pulse reverse plating.

公开(公告)号：EP2796019B1

公开(公告)日：2017-01-04

申请号：EP12805956.5

申请日：2012-11-27

申请人： Atotech Deutschland GmbH

发明人： MIRKOVIC, Marko ,  KLOBUS, Marcin ,  TONG, Terry ,  CHEN, Ted ,  TANG, Tiger ,  MOSER, Christoph

IPC分类号： H05K3/42 ,  C25D3/38 ,  H01L21/288 ,  C23C18/16 ,  C25D7/12 ,  C25D5/18

CPC分类号： H05K3/423 ,  C23C18/1653 ,  C25D3/38 ,  C25D5/02 ,  C25D5/18 ,  C25D7/00 ,  C25D7/123 ,  H05K3/424 ,  H05K2203/0789 ,  H05K2203/1476 ,  H05K2203/1492