The present invention relates to a method for copper electroplating in the manufacture of printed circuit boards, IC substrates and the like. Said method is suitable for a combined conformal through-hole (5) filling and filling of blind micro vias (6). The method utilizes a metal redox system and pulse reverse plating and involves a multilayer laminate comprising a dielectric core layer (1) having an inner copper layer (3), a dielectric outer layer (2) and an outer copper layer (4). A first copper layer (7) is formed by flash plating then copper (8) is electroplated by pulse reverse plating.