公开(公告)号：EP3960898A1

公开(公告)日：2022-03-02

申请号：EP20193722.4

申请日：2020-08-31

申请人： Atotech Deutschland GmbH & Co. KG

发明人： Lautan, Donny ,  Voloshyn, Dmytro ,  Hirsekorn, Isabel-Roda ,  Tews, Dirk ,  Spreemann, Robert

IPC分类号： C23C18/12 ,  C23C18/44 ,  H05K3/00

摘要： The present invention is directed to a composition for depositing a palladium coating on a substrate, in particular on a nickel-coated substrate, the composition comprising:
(i) palladium ions,
(ii) chloride ions,
(iii) ethylenediamine (EDA),
(iv) ethylenediamine disuccinate (EDDS), and
(v) at least one reducing agent.

公开(公告)号：EP4407067A1

公开(公告)日：2024-07-31

申请号：EP23153169.0

申请日：2023-01-24

申请人： Atotech Deutschland GmbH & Co. KG

发明人： Spreemann, Robert ,  Lautan, Donny ,  Kraft, Boris Alexander ,  Voloshyn, Dmytri

IPC分类号： C23C18/44

CPC分类号： C23C18/44

摘要： An aqueous precious metal plating bath, comprising (a) at least one source of precious metal ions; (b) at least one source of hexacyanoferrate (II) ions and/or hexacyanoferrate (III) ions; (c) optionally, at least one source of halogenide; (d) at least one complexing agent; (e) at least one reducing agent for precious metal ions; (f) optionally at least one wetting agent; and (g) optionally, at least one accelerator and a method of depositing of precious metal. The aqueous precious metal plating bath is suitable to provide soft precious metal layers useful for wire bonding and soldering applications which are required for electronic components.