Abstract:
A method of patterning the surface of a substrate with at least one organic semiconducting compound, comprising the steps of: (a) providing a stamp having a surface including a plurality of indentations formed therein defining an indentation pattern, said indentations being contiguous with a stamping surface and defining a stamping pattern, (b) coating said stamping surface with at least one compound (C1) capable of binding to the surface of the substrate and of binding at least one organic semiconducting compound (S), (c) contacting at least a portion of the surface of a substrate with said stamping surface to allow deposition of said compound (C1) on the substrate, (d) removing said stamping surface to provide a pattern of binding sites on the surface of the substrate, (e) applying a plurality of crystallites of the organic semiconducting compound (S) to the surface of the substrate to enable at least a portion of the applied crystallites to bind to at least a portion of the binding sites on the surface of the substrate.
Abstract:
Apparatus including a support body; and an organic semiconductor composition body including at least one of the group including polystyrene, poly(9,9'-dioctylfluorene-co- bithiophene) ('F8T2') and a cellulose, and an organic molecule including a chain-like core region having two ends and having at least three conjugated aromatic rings; and including at the two ends, branched or unbranched groups R1 and R2 respectively, each including a branched or unbranched C5- to C20-alkyl group. Printing inks including such molecule.
Abstract:
The present invention relates to a method of depositing nanowires on the surface of a substrate, comprising the steps of: contacting defined regions of the substrate with at least one compound (C1) capable of binding to the surface of the substrate and of binding the nanowires to provide a pattern of binding sites on the surface of the substrate and/or contacting defined regions of the substrate with at least one compound (C2) capable of binding to the surface of the substrate and preventing the binding of nanowires to provide a pattern of non-binding sites on the surface of the substrate, and contacting the surface of the substrate with a suspension of nanowires in a liquid medium to enable at least a portion of the applied nanowires to bind to at least a portion of the surface of the substrate covered with (C1) and/or not covered with (C2).
Abstract:
Techniques including steps of: providing a support body; forming an organic semiconductor composition body including an organic semiconductor composition on the support body, no more than 10% by weight of the organic semiconductor composition being pentacene; providing a first organic dielectric composition mobilized in a first liquid medium, the organic semiconductor composition being insoluble in the first liquid medium; and forming a first organic dielectric composition body from the first organic dielectric composition on the organic semiconductor composition body. Techniques in which an organic semiconductor composition body is formed on an organic dielectric composition body. Apparatus having an organic dielectric composition body on an organic semiconductor composition body.