HIGH SPEED SUBSTRATE ALIGNER APPARATUS
    1.
    发明公开
    HIGH SPEED SUBSTRATE ALIGNER APPARATUS 审中-公开
    高速设备FOR衬底对准

    公开(公告)号:EP1902460A4

    公开(公告)日:2010-12-29

    申请号:EP06786787

    申请日:2006-07-07

    IPC分类号: H01L21/00 H01L21/68

    摘要: A substrate aligner providing minimal substrate transporter extend and retract motions to quickly align substrate without back side damage while increasing the throughput of substrate processing. In one embodiment, the aligner having an inverted chuck connected to a frame with a substrate transfer system capable of transferring substrate from chuck to transporter without rotationally repositioning substrate. The inverted chuck eliminates aligner obstruction of substrate fiducials and along with the transfer system, allows transporter to remain within the frame during alignment. In another embodiment, the aligner has a rotatable sensor head connected to a frame and a substrate support with transparent rest pads for supporting the substrate during alignment so transporter can remain within the frame during alignment. Substrate alignment is performed independent of fiducial placement on support pads. In other embodiments the substrate support employs a buffer system for buffering substrate inside the apparatus allowing for fast swapping of substrates.