TOPOLOGICAL GLOBAL ROUTING FOR AUTOMATED IC PACKAGE INTERCONNECT
    1.
    发明公开
    TOPOLOGICAL GLOBAL ROUTING FOR AUTOMATED IC PACKAGE INTERCONNECT 审中-公开
    拓扑全球航线服务于自动IC块连接

    公开(公告)号:EP1407393A4

    公开(公告)日:2009-04-29

    申请号:EP02752076

    申请日:2002-06-21

    IPC分类号: G06F17/50 H01L23/12

    CPC分类号: G06F17/5077 G06F2217/40

    摘要: An automated method and system is disclosed to determine an Integrated Circuit (IC) package interconnect routing using a mathematical topological solution. A global topological routing solution is determined to provide singular ideal IC package routing solution. Topological Global Routing provides a mathematical abstraction of the problem that allows multiple optimizations to be performed prior to detailed routing. Preliminary disregard of electrical routing segment width and required clearance allows the global topological solution to be determined quickly. The global topological solution is used in conjunction with necessary design parameters to determine the optimal geometric routing solution. Guide points are determined using the geometric routing solution. A detail router uses the guide points as corners when performing the actual routing.