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1.发明公开
公开(公告)号：EP0545707A1
公开(公告)日：1993-06-09
申请号：EP92311033.2
申请日：1992-12-03
发明人： Kadokura, Susumu, c/o Canon Kabushiki Kaisha , Shirai, Naoki, c/o Canon Kabushiki Kaisha , Yoshimura, Shigeru, c/o Canon Kabushiki Kaisha , Kato, Tomoaki, c/o Canon Kabushiki Kaisha , Tomari, Yoshiaki, c/o Canon Kabushiki Kaisha , Suto, Tadanori, c/o Canon Kabushiki Kaisha
IPC分类号： B65H27/00
CPC分类号： B65H27/00 , B65H2404/18 , B65H2404/5212 , B65H2404/5521
摘要： A delivery member has a substrate material, a first coating film containing a filler and formed by electrodeposition on a substrate material, and a second coating film composed of an organic coating film formed on the first coating film.
摘要翻译： 传送部件具有基板材料，含有填料并通过电沉积在基板材料上形成的第一涂膜，以及由形成在第一涂膜上的有机涂膜构成的第二涂膜。
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2.发明公开Delivery member and apparatus for making use of the same 失效Ausgabeelement und Vorrichtung zu dessen Nutzung。
公开(公告)号：EP0536983A1
公开(公告)日：1993-04-14
申请号：EP92309106.0
申请日：1992-10-06
发明人： Tomari, Yoshiaki, c/o Canon Kabushiki Kaisha , Kadokura, Susumu, c/o Canon Kabushiki Kaisha , Kato, Tomoaki, c/o Canon Kabushiki Kaisha , Suto, Tadanori, c/o Canon Kabushiki Kaisha
摘要： A delivery member has a substrate and, provided thereon, an electro-deposition coating film containing an organic powder.
摘要翻译： 传送部件具有基板，并且在其上设置含有有机粉末的电沉积涂膜。
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3.发明公开Semiconductor device and method of manufacturing semiconductor device 审中-公开Halbleitervorrichtung und Verfahren zur Herstellung der Halbleitervorrichtung
公开(公告)号：EP1329949A2
公开(公告)日：2003-07-23
申请号：EP03001196.9
申请日：2003-01-21
发明人： Muta, Tadayoshi, c/o Canon Kabushiki Kaisha , Tachikawa, Jin, c/o Canon Kabushiki Kaisha , Saito, Riichi, c/o Canon Kabushiki Kaisha , Suto, Tadanori, c/o Canon Kabushiki Kaisha , Takayama, Manabu, c/o Canon Kabushiki Kaisha , Morimoto, Hiroyuki, c/o Canon Kabushiki Kaisha
IPC分类号： H01L21/768
CPC分类号： H01L21/76898 , H01L23/481 , H01L2924/0002 , H01L2924/09701 , H01L2924/12044 , H01L2924/00
摘要： The semiconductor device of the present invention in which an electrical connection is established between front and back surfaces of a substrate (1) by means of at least one through hole (2) formed through the substrate between the front and back surfaces is characterized in that an electrical connection portion (10) is formed by a semiconductor process on at least one surface of the front and back surfaces of the substrate in a vicinity of an end opening of the through hole; an insulating layer (4) formed of an organic material is formed on an inside surface of the through hole; an electroconductive layer (5) is formed on an inside surface of the insulating layer; and the electrical connection portion is electrically connected to the electroconductive layer to be electrically connected to a side of the other surface of the substrate.
摘要翻译： 本发明的半导体器件，其中通过在前表面和后表面之间穿过衬底形成的至少一个通孔（2）在衬底（1）的前表面和后表面之间建立电连接，其特征在于： 通过半导体工艺在基板的前表面和后表面的至少一个表面上在通孔的端部开口附近形成电连接部分（10）; 在通孔的内表面上形成由有机材料形成的绝缘层（4）; 在绝缘层的内表面上形成导电层（5）; 并且所述电连接部分电连接到所述导电层以与所述基板的另一表面的一侧电连接。
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公开(公告)号：EP0545707B1
公开(公告)日：1997-09-17
申请号：EP92311033.2
申请日：1992-12-03
发明人： Kadokura, Susumu, c/o Canon Kabushiki Kaisha , Shirai, Naoki, c/o Canon Kabushiki Kaisha , Yoshimura, Shigeru, c/o Canon Kabushiki Kaisha , Kato, Tomoaki, c/o Canon Kabushiki Kaisha , Tomari, Yoshiaki, c/o Canon Kabushiki Kaisha , Suto, Tadanori, c/o Canon Kabushiki Kaisha
IPC分类号： B65H27/00
CPC分类号： B65H27/00 , B65H2404/18 , B65H2404/5212 , B65H2404/5521
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公开(公告)号：EP0536983B1
公开(公告)日：1997-01-02
申请号：EP92309106.0
申请日：1992-10-06
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