PHOTOELECTRIC CELL
    3.
    发明公开
    PHOTOELECTRIC CELL 有权
    PHOTOELEKTRISCHE ZELLE

    公开(公告)号:EP1119068A4

    公开(公告)日:2006-04-12

    申请号:EP00940898

    申请日:2000-06-30

    摘要: A photoelectric cell comprising a substrate having an electrode layer (21) on the surface thereof and a semiconductor film (22) to which a photosensitizing material is adsorbed and which is formed on the electrode layer surface, and another substrate having on the surface thereof an electrode layer (23), the both substrates being disposed with an electrolyte layer (24) therebetween, at least one substrate and one electrode layer having a transparency, wherein the cell is provided with any one of the following features 1 to 4, and has excellent characteristics, such as a quick electron mobility, an excellent extended stability of an electrolyte layer, and a high photoelectric conversion efficiency. 1. The electrolyte layer consists of an electrolyte and a liquid crystal. 2. Spacer particles (27) are interposed between the semiconductor film (22) and the electrode layer (21). 3. The spacer particles are buried in the semiconductor film, with part of them exposed from the semiconductor film and in contact with the electrode layer (23). 4. The semiconductor film contains metal oxide semiconductor particles having a specific core-shell structure.

    摘要翻译: 一种光电元件,其特征在于,具有在表面具有电极层(21)的基板和吸附光敏材料的半导体膜(22),该半导体膜(22)形成在电极层表面上,另一基板在其表面具有 所述两个基板在其间设置有电解质层(24),至少一个基板和具有透明性的一个电极层,其中所述电池设置有以下特征1至4中的任一个,并且具有电极层 诸如快速电子迁移率,电解质层的优异的扩展稳定性以及高光电转换效率的优良特性。 1.电解质层由电解质和液晶组成。 2.在半导体膜(22)和电极层(21)之间插入间隔粒子(27)。 3.间隔粒子埋入半导体膜中,其中一部分从半导体膜中暴露出来并与电极层(23)接触。 4.半导体膜包含具有特定核 - 壳结构的金属氧化物半导体粒子。

    METHOD OF MANUFACTURING INTEGRATED CIRCUIT, AND SUBSTRATE WITH INTEGRATED CIRCUIT FORMED BY THE METHOD OF MANUFACTURING INTEGRATED CIRCUIT
    4.
    发明公开
    METHOD OF MANUFACTURING INTEGRATED CIRCUIT, AND SUBSTRATE WITH INTEGRATED CIRCUIT FORMED BY THE METHOD OF MANUFACTURING INTEGRATED CIRCUIT 有权
    用于生产集成电路和衬底,通过制定的处理集成电路集成电路受过训练

    公开(公告)号:EP1280193A4

    公开(公告)日:2006-01-04

    申请号:EP01921998

    申请日:2001-04-23

    CPC分类号: H01L21/76877 H01L21/288

    摘要: A method of manufacturing an integrated circuit capable of accumulating conductive fine particles efficiently and densely in micro wiring grooves and connection holes, forming a circuit with less wiring resistance and high density, and allowing high integration to be formed so as to provide excellent profitability, comprising the step of applying an integrated circuit formation coating liquid containing conductive fine particles on a substrate having wiring grooves formed therein, characterized in that the integrated circuit formation coating liquid is applied to the wiring grooves while ultrasonic wave is radiated on the coating liquid.

    摘要翻译: 提供了一种处理在集成电路制造,不仅可以worin导电性微粒可以以分钟布线通道有效且致密地沉积和连接孔但如此低布线电阻和高密度的电路可被形成​​并被worin高度 整合由此可以实现带来的经济优势。 特别地,提供了一种用于在集成电路的制造方法,包括涂布设置有布线通道与涂液用于集成电路形成含有导电性微粒的基片,从而在基板上形成集成电路的,worin涂布液用于集成 电路形成同时暴露于超声波施加到布线通道。