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公开(公告)号:EP0303702A1
公开(公告)日:1989-02-22
申请号:EP88901637.4
申请日:1988-02-12
发明人: YOSHIDA, Kinoto Chichibu Cement Co., Ltd. , FUJII, Morizumi Inax Corporation , TSUDA, Tokihiro 159-42, Shimotakano Sugito-machi
IPC分类号: E01C5/06
CPC分类号: E01C5/00 , E01C2201/02 , Y02A30/68
摘要: Block (1) for pavement characterized in that belt-like portions (2) are formed around the entire periphery of the upper surface of the block by cutting off the periphery in such a manner as to be recessed inward, and to form steps between the beltlike portions (2) and the upper surface of the block (1). According to this structure, the upper end portions of adjacent blocks do not come into mutual contact when they push each other, so that the breakage rate of the blocks can be reduced i remarkably.
摘要翻译: (1),其特征在于,通过以向内凹陷的方式切除周边以围绕块的上表面的整个周边形成带状部分(2),并且在所述块状部分 带状部分(2)和块体(1)的上表面。 根据这种结构,相邻块体的上端部分在彼此推动时不会相互接触,从而可显着减小块体的破损率。
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公开(公告)号:EP0323526B1
公开(公告)日:1992-05-13
申请号:EP88906088.5
申请日:1988-07-13
发明人: YOSHIDA, Kinoto Chichibu Cement Co., Ltd. , FUJII, Morizumi Inax Corporation , TSUDA, Tokihiro , SUDA, Shigeo Chichibu Cement Co., Ltd. , KODAMA, Osamu Chichibu Cement Co., Ltd. , KUROE, Kazuro Chichibu Cement Co., Ltd. , TANIKAWA, Takumi , NISHIMURA, Michihiko , MUNAKATA, Hideyuki
摘要: The fracture-free paving block (1) comprises a cement block substrate (1-1) and a top solid layer (1-2), and is characterized in that the top layer is selected from a cured cement mortar layer and a tile-like layer firmly bonded to the substrate with cement mortar; the top layer is bonded to the block substrate with lateral margins (2) of 1 to 8 mm wide in horizontal distance (15) from the peripheral edges of the substrate; and the vertical distance (16) from the surface of the top layer to the peripheral edge of the substrate is 5 to 50 mm. The method for producing the paving block (1) having a tile-like top layer comprises applying adhesive cement mortar between the back of the top layer (1-2) and the upper surface of the substrate (1-1); placing the top layer on the substrate with the above-mentioned margins (2) of the substrate surface; and applying vibration and/or pressurization between the top layer and the substrate.
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