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公开(公告)号:EP3216231A4
公开(公告)日:2018-06-20
申请号:EP15856698
申请日:2015-11-06
Applicant: CHIRP MICROSYSTEMS INC
Inventor: PRZYBYLA RICHARD , GUEDES ANDRE , SHELTON STEFON , KIANG MENG-HSIUNG , HORSLEY DAVID
IPC: H04R1/20 , G01S7/521 , G01S15/10 , G10K11/00 , G10K11/34 , H04R1/40 , H04R3/04 , H04R17/00 , H04R29/00
CPC classification number: G10K11/002 , G01S7/521 , G01S15/10 , G10K11/346 , H04R3/04 , H04R17/00 , H04R29/002 , H04R29/005 , H04R2201/003 , H04R2217/03
Abstract: A system and method use an array of ultrasonic transducers to emit and receive sound in a phased array fashion by using acoustic waveguides to achieve a desired acoustic radiation and reception pattern. A chip package attached to an acoustic transducer array includes acoustic waveguides coupled to acoustic ports. Each waveguide is coupled between a corresponding acoustic transducer and a corresponding acoustic port. A spacing of a pair of acoustic ports is different than a spacing of a corresponding pair of acoustic transducers.
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公开(公告)号:EP3201122A4
公开(公告)日:2018-05-30
申请号:EP15846584
申请日:2015-10-01
Applicant: CHIRP MICROSYSTEMS INC
Inventor: GUEDES ANDRE , HORSLEY DAVID , KIANG MENG-HSIUNG , PRZYBYLA RICHARD , SHELTON STEFON
CPC classification number: B06B1/0625 , B06B1/0603 , B81B3/00 , G01N29/2437 , G10K9/125 , G10K13/00 , H01L41/33 , H03H9/2447
Abstract: A piezoelectric micromachined ultrasonic transducer (PMUT) device includes a substrate having an opening therethrough and a membrane attached to the substrate over the opening. A portion of the membrane that overlies the opening is divided into a plurality of cantilevers that are mechanically coupled so that the cantilevers resonate at a common frequency.
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公开(公告)号:EP3233311A4
公开(公告)日:2018-08-01
申请号:EP15874212
申请日:2015-12-18
Applicant: CHIRP MICROSYSTEMS INC
Inventor: GUEDES ANDRE , PRZYBYLA RICHARD , SHELTON STEFON , KIANG MENG-HSIUNG , HORSLEY DAVID
CPC classification number: G01N29/2437 , B06B1/0651 , G01N2291/0427 , G10K13/00
Abstract: A piezoelectric micromachined ultrasonic transducer (pMUT) device may include a piezoelectric membrane transducer designed to have lower sensitivity to residual stress and reduced sensitivity to geometric variations arising from the backside etching process used to release the membrane. These designs allow some of its key feature to be adjusted to achieve desired characteristics, such as pressure sensitivity, natural frequency, stress sensitivity, and bandwidth.
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公开(公告)号:EP3140869A4
公开(公告)日:2018-01-10
申请号:EP15789257
申请日:2015-04-02
Applicant: CHIRP MICROSYSTEMS INC
Inventor: SHELTON STEFON , GUEDES ANDRE , PRZYBYLA RICHARD , KIANG MENG-HSIUNG , HORSLEY DAVID
CPC classification number: H03H9/174 , B06B1/0603 , H01L41/0926 , H01L41/0973 , H01L41/187 , H01L41/1873 , H01L41/1876 , H03H9/02244 , H03H9/178 , H03H2009/155 , H04R17/00
Abstract: A transducer includes first and second piezoelectric layers made of corresponding different first and second piezoelectric materials and three or more electrodes, implemented in two or more conductive electrode layers. The first piezoelectric layer is sandwiched between a first pair of electrodes and the second piezoelectric layer is sandwiched between a second pair of electrodes. The first and second pairs of electrodes contain no more than one electrode that is common to both pairs.
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