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公开(公告)号:EP3401687A1
公开(公告)日:2018-11-14
申请号:EP18169381.3
申请日:2018-04-25
Applicant: Honeywell International Inc.
Inventor: WANG, Haibin , LIU, Gaofeng , LIU, Yuguo , CHEN, Longfei , YOU, Du , CHEN, Guihua , GONG, Yunbin , DU, Xiaowei
CPC classification number: F02D41/26 , B81B2201/0257 , F02D41/10 , F02D41/18 , G01P3/44 , G01P3/48 , G01P15/00 , H04R2201/003
Abstract: Turbocharger systems and related methods and devices are provided for determining rotational speed of a turbocharger. A speed sensing device is mounted to a turbocharger and includes an acceleration sensing arrangement and an acoustic sensing arrangement. The speed sensing device outputs an acceleration-based speed value as the current turbo speed when the acceleration-based speed is stable, and otherwise outputs an acoustic-based speed value to as the current turbo speed if the acoustic-based speed value stable or outputs an estimated value as the current turbo speed when both of the acceleration-based and acoustic-based speeds are unstable. In exemplary embodiments, the acceleration sensing arrangement and the acoustic sensing arrangement are provided on a common substrate.
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公开(公告)号:EP2966878B1
公开(公告)日:2018-11-14
申请号:EP15173526.3
申请日:2015-06-24
Applicant: NXP B.V.
Inventor: MACOURS, Christophe
CPC classification number: H04R1/02 , H04R3/00 , H04R3/007 , H04R29/001 , H04R2201/003 , H04R2201/028 , H04R2499/11
Abstract: In an example embodiment, an apparatus includes an enclosure having a loudspeaker mounted therein. The apparatus also includes an IC package mounted inside the enclosure. The IC package includes an amplifier configured to amplify an input audio signal, received at an input of the amplifier, to produce a drive signal. The amplifier is configured to drive the loudspeaker with the drive signal via an output of the amplifier. The IC package also includes a pressure sensor configured to output a status signal, indicative of a sound pressure level inside the enclosure, from an output terminal of the pressure sensor. The apparatus also includes an audio processing circuit connected to the amplifier and configured to adjust strength of the drive signal produced by the amplifier, as a function of the sound pressure level indicated by the status signal.
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公开(公告)号:EP3342749A3
公开(公告)日:2018-09-12
申请号:EP17210331.9
申请日:2017-12-22
Applicant: Sonion Nederland B.V.
Inventor: Mögelin, Raymond , de Roo, Dion Ivo , Blom, Frederik Cornelis , Fransen, Alwin , Mulyar, Pavlo , Post, Peter Christiaan
IPC: B81B3/00
CPC classification number: B81B3/007 , B81B3/0045 , B81B2201/0257 , B81B2201/0264 , H04R19/005 , H04R19/01 , H04R19/04 , H04R2201/003
Abstract: The present invention relates to a micro-electromechanical transducer comprising one or more moveable members, and a viscoelastic substance having a predetermined viscoelasticity, the viscoelastic substance being adapted to influence the response of the transducer in a predetermined manner. The micro-electromechanical transducer of the present invention may include a MEMS transducer, such as a MEMS microphone, a MEMS vibration sensor, a MEMS acceleration sensor, a MEMS receiver.
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公开(公告)号:EP3216231A4
公开(公告)日:2018-06-20
申请号:EP15856698
申请日:2015-11-06
Applicant: CHIRP MICROSYSTEMS INC
Inventor: PRZYBYLA RICHARD , GUEDES ANDRE , SHELTON STEFON , KIANG MENG-HSIUNG , HORSLEY DAVID
IPC: H04R1/20 , G01S7/521 , G01S15/10 , G10K11/00 , G10K11/34 , H04R1/40 , H04R3/04 , H04R17/00 , H04R29/00
CPC classification number: G10K11/002 , G01S7/521 , G01S15/10 , G10K11/346 , H04R3/04 , H04R17/00 , H04R29/002 , H04R29/005 , H04R2201/003 , H04R2217/03
Abstract: A system and method use an array of ultrasonic transducers to emit and receive sound in a phased array fashion by using acoustic waveguides to achieve a desired acoustic radiation and reception pattern. A chip package attached to an acoustic transducer array includes acoustic waveguides coupled to acoustic ports. Each waveguide is coupled between a corresponding acoustic transducer and a corresponding acoustic port. A spacing of a pair of acoustic ports is different than a spacing of a corresponding pair of acoustic transducers.
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公开(公告)号:EP2869598B1
公开(公告)日:2018-06-13
申请号:EP13461555.8
申请日:2013-10-30
Applicant: SVANTEK Sp. z o.o.
Inventor: Barwicz, Wieslaw , Leoniak, Ryszard , Lukaszewski, Lukasz , Kuzmiszyn, Grzegorz
CPC classification number: H04R29/00 , H04R1/20 , H04R1/22 , H04R1/222 , H04R19/005 , H04R19/04 , H04R29/004 , H04R2201/003
Abstract: A device for measuring sound level by a MEMS microphone (12, 152, 252), characterized in that the MEMS microphone (12, 152, 252) is coupled with an acoustic attenuator (11) comprising a pressure divider (120, 220) configured to limit the acoustic pressure which reaches a membrane of the microphone (152, 252) via an inlet channel (205) and a resonant chamber (144, 225).
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公开(公告)号:EP3329690A1
公开(公告)日:2018-06-06
申请号:EP16734615.4
申请日:2016-06-29
Applicant: Epcos AG
Inventor: PAHL, Wolfgang
IPC: H04R1/04
CPC classification number: H04R1/04 , B29C44/1228 , B29C44/188 , B29C44/3415 , B29C65/48 , B29K2101/12 , B29K2105/046 , B29K2995/0097 , B29L2031/34 , B29L2031/3481 , H04R1/021 , H04R1/2811 , H04R1/34 , H04R19/005 , H04R19/016 , H04R19/04 , H04R2201/003 , H04R2201/029
Abstract: A microphone has a housing comprising a base part and an upper part and a transducer element which is arranged in the housing and is electrically and mechanically connected to the base part. In order to install the transducer element in a zero-voltage state, a flexible connection element is proposed which is soft and elastic and/or is compressible, which is arranged between the transducer element and the upper part and which connects the transducer element to the upper part. The connection element comprises a plastic in which gas bubbles are distributed, wherein the gas bubbles in the connection element have a volume fraction between 50% and 98%.
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公开(公告)号:EP3328093A1
公开(公告)日:2018-05-30
申请号:EP17203756.6
申请日:2017-11-27
Applicant: Semiconductor Manufacturing International Corporation (Beijing) , Semiconductor Manufacturing International Corporation (Shanghai)
Inventor: WANG, Qiang
CPC classification number: H04R9/08 , B81B3/0086 , B81B2201/0257 , B81B2203/04 , B81C1/00698 , B81C2201/0109 , H04R19/005 , H04R31/00 , H04R2201/003
Abstract: A microphone includes a substrate, an opening extending through the substrate, a first electrode plate layer on the opening, a second electrode plate layer spaced apart from the first electrode plate layer, a support structure layer on the substrate including an electrode attachment portion operable to attach the second electrode plate layer and a stopper operable to block contact between the first electrode plate layer and the second electrode plate layer, a cavity delineated by the support structure layer, the first electrode plate layer, and the substrate, and a conductive material layer on the support structure layer and spaced apart from the second electrode plate layer. The microphone has a significantly lower leakage current than conventional semiconductor microphones.
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公开(公告)号:EP3324646A1
公开(公告)日:2018-05-23
申请号:EP17202253.5
申请日:2017-11-17
Applicant: Sonion Nederland B.V.
Inventor: Lafort, Adrianus Maria , van Nieuwkerk, Michiel
CPC classification number: H03F1/548 , H03F1/523 , H03F1/56 , H03F3/10 , H03F3/187 , H03F3/195 , H03F2200/03 , H03F2200/222 , H03F2200/426 , H03F2200/444 , H03F2200/451 , H03H11/28 , H04R3/00 , H04R19/005 , H04R19/04 , H04R2201/003
Abstract: A system comprising a transducer and an amplifier as well as a circuit which always has a high impedance at low voltages. In addition, at high voltages, the circuit has a high impedance at high frequencies but a low impedance at low frequencies. In biased transducers, this circuit may be used between the charge pump and the transducer. In general, the circuit may be provided in a signal path between the transducer and the amplifier. The circuit has as an advantage that at startup, low frequency signals at high intensities may overload the amplifier, whereas at operation, higher frequency signals are desired fed to the amplifier at the same intensity. This is facilitated by the circuit.
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公开(公告)号:EP3205118A4
公开(公告)日:2018-04-18
申请号:EP15848384
申请日:2015-10-06
Inventor: GASKELL PETER , GASKELL ROBERT ERIC , SZKOPEK THOMAS , HONG JUNG WOOK
CPC classification number: H04R31/003 , H01B1/04 , H04R7/04 , H04R7/14 , H04R9/048 , H04R2201/003 , H04R2307/023
Abstract: Materials used in acoustic transducer membranes need very specific qualities that in any real system require many tradeoffs to be made. Graphene and graphene related materials are a newly discovered class of materials with some exceptional properties that offer the potential for significant contributions to the performance of many acoustical transduction systems. Accordingly the inventors have established graphene oxide based transducers as the basis of ribbon microphones and diaphragm loudspeakers using low cost manufacturing and processing techniques.
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10.
公开(公告)号:EP3111233B1
公开(公告)日:2018-04-04
申请号:EP15712692.1
申请日:2015-02-26
Applicant: Murata Manufacturing Co., Ltd.
Inventor: AHTEE, Ville , RYTKÖNEN, Ville-Pekka
IPC: G01P15/125 , G01P15/08 , B81B3/00
CPC classification number: B81B3/0051 , B81B2201/0235 , B81B2203/051 , G01P15/125 , G01P2015/0814 , G01P2015/0871 , H04R23/00 , H04R2201/003
Abstract: A microelectromechanical structure, comprises a first element that includes a first element surface, and a second element that includes a second element surface, and an element gap between the first element surface and the second element surface. At least one of the first element and the second element is mobile. One of the first and second element surfaces includes a convex contact surface and the other one of the first and second element surfaces includes a concave contact surface.
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