专利检索 ap:("CMC Materials LLC") AND inv:"REISS, Brian" 第 1 页

1.

发明公开
SILICA-BASED SLURRY COMPOSITIONS CONTAINING HIGH MOLECULAR WEIGHT POLYMERS FOR USE IN CMP OF DIELECTRICS 审中-实审

公开(公告)号：EP4405428A1

公开(公告)日：2024-07-31

申请号：EP22873610.4

申请日：2022-09-23

申请人： CMC Materials LLC

发明人： REISS, Brian , JOHNSON, Brittany , NAIK, Sajo , LU, Lung-Tai , LONG, Kim , KNAPTON, Elliot , ROBELLO, Douglas , BROSNAN, Sarah

IPC分类号： C09G1/02 , H01L21/306 , B24B37/04

CPC分类号： H01L21/31053 , H01L21/3212 , C09G1/02 , H01L21/76224