公开(公告)号：EP3049213A4

公开(公告)日：2017-12-27

申请号：EP14840396

申请日：2014-08-28

申请人： CORNING INC

发明人： BURKET ROBERT CARL ,  GOERS UTA-BARBARA ,  OWUSU SAMUEL ODEI ,  PETRIWSKY TAMMY LYNN

IPC分类号： B23K26/36

CPC分类号： C03C15/00 ,  B23K26/006 ,  B23K26/302 ,  B23K26/362 ,  B23K26/364 ,  B23K26/382 ,  B23K26/384 ,  B23K26/402 ,  B23K2203/54 ,  C03B33/0222 ,  C03C23/00 ,  C03C23/0025 ,  C03C2218/34 ,  H05K1/0306 ,  H05K3/0017 ,  H05K3/002 ,  H05K3/0029 ,  H05K2203/0285

摘要： Methods for forming vias in glass substrates by laser drilling and acid etching are disclosed. In one embodiment, a method forming a via in a glass substrate includes laser drilling the via through at least a portion of a thickness of the glass substrate from an incident surface of the glass substrate. The method further includes etching the glass substrate for an etching duration to increase a diameter of an incident opening of the via and applying ultrasonic energy to the glass substrate during at least a portion of the etching duration. The applied ultrasonic energy has a frequency between 40 kHz and 192 kHz.