公开(公告)号：EP0983136A1

公开(公告)日：2000-03-08

申请号：EP98914604.8

申请日：1998-04-07

申请人： Cardxx, Inc.

发明人： TIFFANY, Harry, J., III.

IPC分类号： B29C45/16 ,  B29C69/00 ,  H01L23/02

CPC分类号： B29C45/14647 ,  B29C70/685 ,  B29C2045/14532 ,  B29C2045/2714 ,  G06K19/07745 ,  H01L2924/0002 ,  H01L2924/00

摘要： Smart cards having high quality external surfaces (55, 58) can be made through use of partially cured, low shrinkage glues (42, 42', 62, 62') to hold the smart card's electronic elements (30, 32) during their immersion in a thermosetting material (34) that becomes the core layer of the cards.