公开(公告)号：EP1844531A1

公开(公告)日：2007-10-17

申请号：EP05724485.7

申请日：2005-03-03

申请人： Cardxx, Inc

发明人： REED, Paul

IPC分类号： H01S4/00

CPC分类号： B29C45/14647 ,  B29C45/14467 ,  B29C2045/14532 ,  B29K2027/06 ,  B29K2063/00 ,  B29K2075/00 ,  H01L21/565 ,  H01L23/3135 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05553 ,  H01L2224/16 ,  H01L2224/48472 ,  H01L2224/49175 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/181 ,  H05K1/117 ,  H05K3/0058 ,  H05K3/284 ,  H05K3/386 ,  H05K3/4007 ,  H05K2203/063 ,  H05K2203/1316 ,  Y10T29/49121 ,  Y10T29/49146 ,  Y10T29/49172 ,  Y10T29/49176 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： Memory Card (10) containing Integrated Circuits and other electronic components is made by means of injection molding. External surfaces of e.g. polycarbonate, synthetic paper, PVC or the like are used to house the Memory Card (10) or similar device prior to the injection molding step. After a thermosetting material is injection molded the Memory Card (10) is removed from the two (2) mold halves and is trimmed.

摘要翻译： 含有聚碳酸酯，合成纸（例如特斯林）或其他合适材料（如PVC）的高质量外表面的各种形状因子的集成电路和其他电子部件（例如电阻）的存储卡可以通过使用注射成型 热塑性材料或热固性材料，成为所述存储卡和类似装置的核心层。 本发明的目的是为存储卡提供以下特性：快速生产周期，大批量制造吞吐量，安全性，电子保护，更好的防篡改，耐久性和高度可靠的复杂电子封装，通过使用低温和 低压。

公开(公告)号：EP1064136A1

公开(公告)日：2001-01-03

申请号：EP99912574.3

申请日：1999-03-16

申请人： Cardxx, Inc.

发明人： TIFFANY, Harry, J., III

IPC分类号： B29C45/14 ,  B29C70/70 ,  B29C70/84 ,  H01L23/31 ,  H01L31/0216 ,  H01L31/0203

CPC分类号： G06K19/07745 ,  B29C45/14467 ,  B29C45/14647 ,  B29C45/2669 ,  B29C2045/14532 ,  G06K19/077 ,  H01L2924/0002 ,  H01L2924/00

摘要： Smart cards (10) having high quality external surfaces (46, 48) can be made through use of a primer/adhesive (52) (and, optionally, anchor hooks (58, 58A)) on the lower surface of an electrical component (12, 30) in order to affix the electrical component (12, 30) to a thermosetting material (54) that becomes the core layer (20) of the cards (10).

公开(公告)号：EP1844531A4

公开(公告)日：2009-05-06

申请号：EP05724485

申请日：2005-03-03

申请人： CARDXX INC

发明人： REED PAUL

IPC分类号： H01S4/00 ,  B29C45/14

CPC分类号： B29C45/14647 ,  B29C45/14467 ,  B29C2045/14532 ,  B29K2027/06 ,  B29K2063/00 ,  B29K2075/00 ,  H01L21/565 ,  H01L23/3135 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05553 ,  H01L2224/16 ,  H01L2224/48472 ,  H01L2224/49175 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/181 ,  H05K1/117 ,  H05K3/0058 ,  H05K3/284 ,  H05K3/386 ,  H05K3/4007 ,  H05K2203/063 ,  H05K2203/1316 ,  Y10T29/49121 ,  Y10T29/49146 ,  Y10T29/49172 ,  Y10T29/49176 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： Memory Card (10) containing Integrated Circuits and other electronic components is made by means of injection molding. External surfaces of e.g. polycarbonate, synthetic paper, PVC or the like are used to house the Memory Card (10) or similar device prior to the injection molding step. After a thermosetting material is injection molded the Memory Card (10) is removed from the two (2) mold halves and is trimmed.

公开(公告)号：EP0983136A4

公开(公告)日：2002-05-08

申请号：EP98914604

申请日：1998-04-07

申请人： CARDXX INC

发明人： TIFFANY HARRY J III

IPC分类号： B42D15/10 ,  B29C45/14 ,  B29C70/68 ,  G06K19/077 ,  B29C45/16 ,  B29C69/00 ,  H01L23/02

CPC分类号： B29C45/14647 ,  B29C70/685 ,  B29C2045/14532 ,  B29C2045/2714 ,  G06K19/07745 ,  H01L2924/0002 ,  H01L2924/00

摘要： Smart cards having high quality external surfaces (55, 58) can be made through use of partially cured, low shrinkage glues (42, 42', 62, 62') to hold the smart card's electronic elements (30, 32) during their immersion in a thermosetting material (34) that becomes the core layer of the cards.

公开(公告)号：EP0983136A1

公开(公告)日：2000-03-08

申请号：EP98914604.8

申请日：1998-04-07

申请人： Cardxx, Inc.

发明人： TIFFANY, Harry, J., III.

IPC分类号： B29C45/16 ,  B29C69/00 ,  H01L23/02

CPC分类号： B29C45/14647 ,  B29C70/685 ,  B29C2045/14532 ,  B29C2045/2714 ,  G06K19/07745 ,  H01L2924/0002 ,  H01L2924/00

摘要： Smart cards having high quality external surfaces (55, 58) can be made through use of partially cured, low shrinkage glues (42, 42', 62, 62') to hold the smart card's electronic elements (30, 32) during their immersion in a thermosetting material (34) that becomes the core layer of the cards.

公开(公告)号：EP1864249B1

公开(公告)日：2014-12-24

申请号：EP05729405.0

申请日：2005-03-23

申请人： Cardxx, Inc

发明人： REED, Paul

IPC分类号： G06K19/06 ,  B29C45/14

CPC分类号： G06K19/073 ,  B29C45/1418 ,  B29C45/14467 ,  B29C45/14647 ,  B29C45/34 ,  B29C2045/14532 ,  G06K19/077 ,  G06K19/07724 ,  Y10T29/49121 ,  Y10T29/49146 ,  Y10T29/49172

公开(公告)号：EP1864249A4

公开(公告)日：2008-10-29

申请号：EP05729405

申请日：2005-03-23

申请人： CARDXX INC

发明人： REED PAUL

IPC分类号： G06K19/06 ,  B29C45/14

CPC分类号： G06K19/073 ,  B29C45/1418 ,  B29C45/14467 ,  B29C45/14647 ,  B29C45/34 ,  B29C2045/14532 ,  G06K19/077 ,  G06K19/07724 ,  Y10T29/49121 ,  Y10T29/49146 ,  Y10T29/49172

摘要： Advanced Smart Cards and similar form factors (e.g. documents, tags) having high quality external surfaces of Polyvinylchloride (PVC), Polycarbonate (PC), synthetic paper or other suitable material can be made with highly sophisticated electronic components (e.g. Integrated Circuit chips, batteries, microprocessors, Light Emitting Diodes, Liquid Crystal Displays, polymer dome switches, and antennae), integrated in the bottom layer of the card structure, through use of injection molded thermosetting or thermoplastic material that becomes the core layer of said Advanced Smart Cards. A lamination finishing process can provide a high quality lower surface, and the encapsulation of the electronic components in the thermosetting or thermoplastic material provides protection from the lamination heat and pressure.

公开(公告)号：EP1864249A1

公开(公告)日：2007-12-12

申请号：EP05729405.0

申请日：2005-03-23

申请人： Cardxx, Inc

发明人： REED, Paul

IPC分类号： G06K19/06

CPC分类号： G06K19/073 ,  B29C45/1418 ,  B29C45/14467 ,  B29C45/14647 ,  B29C45/34 ,  B29C2045/14532 ,  G06K19/077 ,  G06K19/07724 ,  Y10T29/49121 ,  Y10T29/49146 ,  Y10T29/49172

摘要： Advanced Smart Cards and similar form factors (e.g. documents, tags) having high quality external surfaces of Polyvinylchloride (PVC), Polycarbonate (PC), synthetic paper or other suitable material can be made with highly sophisticated electronic components (e.g. Integrated Circuit chips, batteries, microprocessors, Light Emitting Diodes, Liquid Crystal Displays, polymer dome switches, and antennae), integrated in the bottom layer of the card structure, through use of injection molded thermosetting or thermoplastic material that becomes the core layer of said Advanced Smart Cards. A lamination finishing process can provide a high quality lower surface, and the encapsulation of the electronic components in the thermosetting or thermoplastic material provides protection from the lamination heat and pressure.

公开(公告)号：EP1109659A4

公开(公告)日：2002-05-29

申请号：EP99912587

申请日：1999-03-16

申请人： CARDXX INC

发明人： TIFFANY HARRY J III

IPC分类号： B42D15/10 ,  B29C45/14 ,  B29C70/68 ,  G06K19/077 ,  H01L21/56 ,  B29C70/70 ,  B29C70/84 ,  H01L23/31 ,  H01L31/0203 ,  H01L31/0216

CPC分类号： G06K19/07724 ,  B29C45/14647 ,  B29C45/2708 ,  B29C70/685 ,  B29C2045/14532 ,  B29C2045/2714 ,  G06K19/077 ,  Y10T29/49117 ,  Y10T29/49121 ,  Y10T29/4913

摘要： Smart cards employing ITA-based circuits (22A-22D) can be made by associating a splitter edge material (52) with the ITA-based circuit (22A-22D) in order to direct an incoming stream (12) of thermosetting polymeric above (12A) and below (12B) the ITA-based circuit (22A-22D).

摘要翻译： 使用基于ITA的电路的智能卡可以通过将分流器边缘材料与基于ITA的电路相关联来制造，以便引导基于ITA的电路上方和下方的热固性聚合物的进入流。

公开(公告)号：EP1109659A1

公开(公告)日：2001-06-27

申请号：EP99912587.5

申请日：1999-03-16

申请人： Cardxx, Inc.

发明人： TIFFANY, Harry, J., III

IPC分类号： B29C45/14 ,  B29C70/70 ,  B29C70/84 ,  H01L23/31 ,  H01L31/0203 ,  H01L31/0216

CPC分类号： G06K19/07724 ,  B29C45/14647 ,  B29C45/2708 ,  B29C70/685 ,  B29C2045/14532 ,  B29C2045/2714 ,  G06K19/077 ,  Y10T29/49117 ,  Y10T29/49121 ,  Y10T29/4913

摘要： Smart cards employing ITA-based circuits (22A-22D) can be made by associating a splitter edge material (52) with the ITA-based circuit (22A-22D) in order to direct an incoming stream (12) of thermosetting polymeric above (12A) and below (12B) the ITA-based circuit (22A-22D).