摘要:
The invention relates to a method whereby a laser beam having a pre-determined wavelength is used to etch a zone (16) of a film (14) of a first material, said zone (16) being deposited on the surface of at least two materials (10, 12). The method consists in: depositing a film (18) of a third material on the film (14) of first material, the first and third materials having a chemical affinity during the application of the laser beam that is greater than the chemical affinity during the application between the first material and each of said at least two second materials; and applying the laser beam to a zone of a free surface of the film (18) of third material vertically above the zone (16) of the film (14) of first material, with a fluence of the laser beam causing the separation of said zone (16).
摘要:
The invention relates to an object which can be authenticated and which comprises a substrate, said substrate containing at least one authenticating or identification pattern. Said pattern is covered by a cover for masking and exposing the pattern. The pattern is fluorescent and comprises organic fluorescent particles and/or inorganic fluorescent particles included in the substrate. The cover can be physically or structurally deformed in order to expose said pattern.
摘要:
The invention relates to a process for manufacturing two photovoltaic cells (12, 14) connected in series, which process comprises: producing an insulating substrate (32); forming a multilayer comprising - a first conductive layer (30) formed on the substrate (30), a semiconductor layer (36) comprising a first absorbing layer (38) and a second semiconductor layer (40) forming a junction with the first absorbing layer (38), and a second transparent conductive layer (44) formed on the absorbing layer (36); and forming a region (78) that divides the multilayer into two cells (12, 14) connected in series by an electrical path. The formation of said path comprises: forming a first trench (70) down to the substrate (32); forming a second trench (72) down to the first conductive layer (30); and depositing a conductive solution (76) into the first trench (70) and at least into a portion of the second trench (72) such that the solution (76) that penetrates into the first trench (70) does not reach the first conductive layer (30) and the solution (76) that penetrates into the second trench (72) reaches the first conductive layer (30).