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1.
公开(公告)号:EP2577729A1
公开(公告)日:2013-04-10
申请号:EP11723935.0
申请日:2011-05-31
申请人: Commissariat à l'Énergie Atomique et aux Énergies Alternatives , Centre National de la Recherche Scientifique , Institut Polytechnique de Grenoble
发明人: AVENAS, Yvan , CREBIER, Jean-Christophe , WIDIEZ, Julie , CLAVELIER, Laurent , VLADIMIROVA, Kremena
IPC分类号: H01L25/07 , H01L23/473
CPC分类号: H01L23/46 , H01L23/473 , H01L25/074 , H01L33/648 , H01L2924/0002 , H01L2924/00
摘要: The invention relates to an electronic chip, comprising: a semiconductor substrate (6) having an active area (8) formed by at least one P doped region and at least one N doped region which form one or more P-N junctions through which most of the useful current flows when said electronic chip is in a conductive state, and at least one channel (44) through which a heat transport coolant can flow, the channel(s) passing through at least said P or N doped region of the active area. Each channel (44) is rectilinear and passes through the substrate (6) in a direction which is collinear with a direction F to the nearest ± 45°, where the direction F is perpendicular to the plane of the substrate.
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2.
公开(公告)号:EP2577729B1
公开(公告)日:2014-03-12
申请号:EP11723935.0
申请日:2011-05-31
申请人: Commissariat à l'Énergie Atomique et aux Énergies Alternatives , Centre National de la Recherche Scientifique , Institut Polytechnique de Grenoble
发明人: AVENAS, Yvan , CREBIER, Jean-Christophe , WIDIEZ, Julie , CLAVELIER, Laurent , VLADIMIROVA, Kremena
IPC分类号: H01L25/07 , H01L23/473 , H01L33/64
CPC分类号: H01L23/46 , H01L23/473 , H01L25/074 , H01L33/648 , H01L2924/0002 , H01L2924/00
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公开(公告)号:EP3847694A2
公开(公告)日:2021-07-14
申请号:EP19774162.2
申请日:2019-09-02
申请人: Commissariat à l'énergie atomique et aux énergies alternatives , Centre National de la Recherche Scientifique
IPC分类号: H01L23/373 , H01L25/07 , H01L25/16 , H01L21/60
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