LED LIGHTING DEVICES WITH QUANTUM DOT GLASS CONTAINMENT PLATES
    1.
    发明公开
    LED LIGHTING DEVICES WITH QUANTUM DOT GLASS CONTAINMENT PLATES 审中-公开
    量子DOT限制玻璃LED照明设备

    公开(公告)号:EP2926381A1

    公开(公告)日:2015-10-07

    申请号:EP13812256.9

    申请日:2013-11-26

    IPC分类号: H01L33/50

    摘要: A lighting device is provided comprising a chip-on-board (COB) light emitting diode (LED) light source, a light source encapsulant, a quantum dot distributed color conversion medium, and a quantum dot glass containment plate. The COB LED light source comprises at least one LED and defines a light source encapsulant cavity in which the light source encapsulant is distributed over the LED. The quantum dot glass containment plate is positioned over the light source encapsulant cavity and contains a quantum dot distributed color conversion medium. The distributed color conversion medium comprises a quantum dot structure and is distributed in two dimensions over an emission field of the lighting device within the quantum dot glass containment plate.

    TOUCH SCREEN ASSEMBLIES FOR ELECTRONIC DEVICES
    4.
    发明公开
    TOUCH SCREEN ASSEMBLIES FOR ELECTRONIC DEVICES 审中-公开
    TOUCH SCREEN安排于电子设备

    公开(公告)号:EP2825941A1

    公开(公告)日:2015-01-21

    申请号:EP13761448.3

    申请日:2013-03-13

    IPC分类号: G06F3/041 H01L51/50

    CPC分类号: G06F3/044 G06F2203/04103

    摘要: In one embodiment, a touch screen assembly includes a sealing glass comprising ion-exchange strengthened glass having a first coefficient of thermal expansion CTE
    1 . The assembly may also include a backplane glass comprising ion-exchangeable glass having a device surface, an underside and a second coefficient of thermal expansion CTE
    2 , wherein CTE
    2 is within +/- 15.0x10
    -7 /°C of CTE
    1 . The device surface of the backplane glass is bonded and hermetically sealed to the underside of the sealing glass with a frit seal which encloses a device area between the underside of the sealing glass and the device surface of the backplane glass. An array of metal oxide thin film transistors may be deposited on the device surface of the backplane glass in the device area, wherein the array of metal oxide thin film transistors have a third coefficient of thermal expansion CTE
    3 that is within +/- 15.0x10
    -7 /°C of CTE
    1 .

    SOLAR-REDSHIFT SYSTEMS
    5.
    发明公开
    SOLAR-REDSHIFT SYSTEMS 有权
    太阳红移系统

    公开(公告)号:EP2737620A1

    公开(公告)日:2014-06-04

    申请号:EP12820061.5

    申请日:2012-06-20

    IPC分类号: H02N6/00

    摘要: Solar-redshift systems comprise an integral array of redshift modules, each having at least a focusing device, a target, and a quantum-dot vessel. The quantum-dot vessel contains quantum dots that emit light having an emission wavelength. The focusing device directs incident solar radiation through a focusing gap and toward the quantum-dot vessel, or into a slab waveguide and then toward the quantum-dot vessel, causing the quantum dots to emit redshifted light having the emission wavelength. The redshifted light is directed to the target, examples of which include a photovoltaic material or a living photosynthetic organism. The target has increased sensitivity or response to photons having the wavelength of the redshifted light. A trapping reflector component of the quantum-dot vessel prevents loss of redshifted light to the environment outside the solar-redshift system and allows undesirable infrared light to be removed from the system.

    摘要翻译: 太阳红移系统包括红移模块的整体阵列,每个红移模块至少具有聚焦装置,靶标和量子点容器。 量子点容器包含发射具有发射波长的光的量子点。 聚焦装置将入射的太阳辐射引导通过聚焦间隙并朝向量子点容器或平板波导,然后朝向量子点容器引导量子点发射具有发射波长的红移光。 红移光被导向目标,其例子包括光伏材料或活的光合生物。 目标对具有红移光的波长的光子的灵敏度或响应增加。 量子点容器的俘获反射器部件防止红移光损失到太阳红移系统外部的环境,并且允许不希望的红外光从系统中移除。

    LED LIGHTING DEVICES
    8.
    发明公开
    LED LIGHTING DEVICES 审中-公开
    LED照明器具

    公开(公告)号:EP2973699A1

    公开(公告)日:2016-01-20

    申请号:EP14721609.7

    申请日:2014-03-13

    摘要: Packaged chip-on-board (COB) LED arrays are provided where a color conversion medium is distributed within a glass containment plate, rather than silicone, to reduce the operating temperature of the color conversion medium and avoid damage while increasing light output. A lighting device is provided comprising a chip-on-board (COB) light emitting diode (LED) light source, a light source encapsulant, a distributed color conversion medium, and a glass containment plate. The COB LED light source comprises a thermal heat sink framework and at least one LED and defines a light source encapsulant cavity in which the light source encapsulant is distributed over the LED. The glass containment plate is positioned over the light source encapsulant cavity and contains the distributed color conversion medium. The light source encapsulant is distributed over the LED at a thickness that is sufficient to encapsulate the LED and define encapsulant thermal conduction paths.